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IRF1407SPBF Scheda tecnica(PDF) 1 Page - International Rectifier |
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IRF1407SPBF Scheda tecnica(HTML) 1 Page - International Rectifier |
1 / 12 page Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 100 ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 70 A IDM Pulsed Drain Current 520 PD @TA = 25°C Power Dissipation 3.8 W PD @TC = 25°C Power Dissipation 200 W Linear Derating Factor 1.3 W/°C VGS Gate-to-Source Voltage ± 20 V EAS Single Pulse Avalanche Energy 390 mJ IAR Avalanche Current See Fig.12a, 12b, 15, 16 A EAR Repetitive Avalanche Energy mJ dv/dt Peak Diode Recovery dv/dt 4.6 V/ns TJ Operating Junction and -55 to + 175 TSTG Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case ) °C HEXFET® Power MOSFET S D G Absolute Maximum Ratings VDSS = 75V RDS(on) = 0.0078Ω ID = 100A Description 06/30/04 www.irf.com 1 Advanced Process Technology Ultra Low On-Resistance Dynamic dv/dt Rating 175°C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to Tjmax Lead-Free Benefits PD -95486 Parameter Typ. Max. Units RθJC Junction-to-Case ––– 0.75 °C/W RθJA Junction-to-Ambient(PCB Mounted,steady-state)** ––– 40 Thermal Resistance IRF1407SPbF IRF1407LPbF TO-262 IRF1407L D2Pak IRF1407S Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRF1407L) is available for low- profile applications. **When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note #AN-994. |
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