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BD35395FJ-M Scheda tecnica(PDF) 11 Page - Rohm

Il numero della parte BD35395FJ-M
Spiegazioni elettronici  Incorporates an enabler
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Produttore elettronici  ROHM [Rohm]
Homepage  http://www.rohm.com
Logo ROHM - Rohm

BD35395FJ-M Scheda tecnica(HTML) 11 Page - Rohm

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Datasheet
Datasheet
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TSZ02201-0R6R0AN00610-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
5.Jun.2014 Rev.002
www.rohm.com
TSZ22111 • 15 • 001
BD35395FJ-M
Power Dissipation
Thermal design must be conducted with the operation under the conditions listed below (which are the guaranteed
temperature range requiring consideration on appropriate margins etc);
1: Ambient temperature Ta: 105℃ or lower
2:Chip junction temperature Tj: 150℃ or lower
The chip junction temperature Tj can be considered as follows:
Most of heat loss in BD35395FJ-M occurs at the output N-channel FET.
The power lost is determined by multiplying the
voltage between VIN and Vo by the output current.
As this IC employs the power PKG, the thermal derating characteristics
significantly depends on the pc board conditions.
When designing, care must be taken to the size of a pc board to be
used.
Power consumption (W) =
Input voltage (VTT_IN)-Output voltage (VTT≒1/2VDDQ) ×Io(Ave)
Example) Where VTT_IN =1.8V, VDDQ=1.8V, Io(Ave)= 0.5A
= 0.45(W)
Heat dissipation characteristics
Power consumption(W) =
1.8(V)-0.9(V)
×0.5(A)
(1) mounted on 70mm×70mm×1.6mm glass-epoxy board
θj-c=185.2℃/W
(2) With no heat sink
θj-a=222.2℃/W
0.6
0
25
75
100
125
150
50
0.2
0.1
0
[℃]
0.4
0.5
0.3
[W]
(2) 0.563W
105℃
(1) 0.675W
0.7
Ambient temperature
[Ta]


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