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SI1499DH Scheda tecnica(PDF) 8 Page - Vishay Siliconix |
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SI1499DH Scheda tecnica(HTML) 8 Page - Vishay Siliconix |
8 / 12 page AN815 Vishay Siliconix www.vishay.com 2 Document Number: 71334 12-Dec-03 FIGURE 3. Front of Board SC70-6 Back of Board SC70-6 vishay.com THERMAL PERFORMANCE Junction-to-Foot Thermal Resistance (Package Performance) The junction to foot thermal resistance is a useful method of comparing different packages thermal performance. A helpful way of presenting the thermal performance of the 6-Pin SC-70 copper leadframe device is to compare it to the traditional Alloy 42 version. Thermal performance for the 6-pin SC-70 measured as junction-to-foot thermal resistance, where the “foot” is the drain lead of the device at the bottom where it meets the PCB. The junction-to-foot thermal resistance is typically 40_C/W in the copper leadframe and 163_C/W in the Alloy 42 leadframe — a four-fold improvement. This improved performance is obtained by the enhanced thermal conductivity of copper over Alloy 42. Power Dissipation The typical RqJA for the single 6-pin SC-70 with copper leadframe is 103_C/W steady-state, compared with 212_C/W for the Alloy 42 version. The figures are based on the 1-inch2 FR4 test board. The following example shows how the thermal resistance impacts power dissipation for the two different leadframes at varying ambient temperatures. ALLOY 42 LEADFRAME Room Ambient 25 _C Elevated Ambient 60 _C PD + TJ(max) * TA RqJA PD + 150oC * 25oC 212oC W PD + 590 mW PD + TJ(max) * TA RqJA PD + 150oC * 25oC 212oC W PD + 425 mW COOPER LEADFRAME Room Ambient 25 _C Elevated Ambient 60 _C PD + TJ(max) * TA RqJA PD + 150oC * 25oC 124oC W PD + 1.01 W PD + TJ(max) * TA RqJA PD + 150oC * 60oC 124oC W PD + 726 mW As can be seen from the calculations above, the compact 6-pin SC-70 copper leadframe LITTLE FOOT power MOSFET can handle up to 1 W under the stated conditions. Testing To further aid comparison of copper and Alloy 42 leadframes, Figure 5 illustrates single-channel 6-pin SC-70 thermal performance on two different board sizes and two different pad patterns. The measured steady-state values of RqJA for the two leadframes are as follows: LITTLE FOOT 6-PIN SC-70 Alloy 42 Copper 1) Minimum recommended pad pattern on the EVB board V (see Figure 3. 329.7_C/W 208.5_C/W 2) Industry standard 1-inch2 PCB with maximum copper both sides. 211.8_C/W 103.5_C/W The results indicate that designers can reduce thermal resistance (RqJA) by 36% simply by using the copper leadframe device rather than the Alloy 42 version. In this example, a 121_C/W reduction was achieved without an increase in board area. If increasing in board size is feasible, a further 105_C/W reduction could be obtained by utilizing a 1-inch2 square PCB area. The copper leadframe versions have the following suffix: Single: Si14xxEDH Dual: Si19xxEDH Complementary: Si15xxEDH |
Codice articolo simile - SI1499DH_15 |
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Descrizione simile - SI1499DH_15 |
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