IRF7526D1 datasheet(1/8 Pages) IRF

Il numero della parte	IRF7526D1

Spiegazioni elettronici	FETKY??MOSFET & Schottky Diode(Vdss=-30V, Rds(on)=0.20ohm, Schottky Vf=0.39V)

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Produttore elettronici	IRF [International Rectifier]

Homepage	http://www.irf.com

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IRF7526D1

FETKY

MOSFET & Schottky Diode

TM

Description

l Co-packaged HEXFET® Power

MOSFET and Schottky Diode

l P-Channel HEXFET

l Low VF Schottky Rectifier

l Generation 5 Technology

l Micro8TM Footprint

VDSS = -30V

RDS(on) = 0.20Ω

Schottky Vf = 0.39V

Micro8

TM

Notes:

Repetitive rating – pulse width limited by max. junction temperature (see Fig. 9)

ISD ≤ -1.2A, di/dt ≤ 160A/µs, VDD ≤ V(BR)DSS, TJ ≤ 150°C

Pulse width ≤ 300µs – duty cycle ≤ 2%

When mounted on 1 inch square copper board to approximate typical multi-layer PCB thermal resistance

5/7/99

T op V ie w

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Absolute Maximum Ratings

Parameter

Maximum

Units

RθJA

Junction-to-Ambient

100

°C/W

Thermal Resistance Ratings

Parameter

Maximum

Units

ID @ TA = 25°C

-2.0

ID @ TA = 70°C

-1.6

IDM

Pulsed Drain Current

-16

PD @TA = 25°C

1.25

PD @TA = 70°C

0.8

Linear Derating Factor

10

mW/°C

VGS

Gate-to-Source Voltage

± 20

V

dv/dt

Peak Diode Recovery dv/dt

-5.0

V/ns

TJ, TSTG

Junction and Storage Temperature Range

-55 to +150

°C

Continuous Drain Current, VGS @ -4.5V

Power Dissipation

A

W

The FETKY

TM

family of co-packaged HEXFETs and Schottky diodes offer the

designer an innovative board space saving solution for switching regulator

applications. Generation 5 HEXFETs utilize advanced processing techniques to

achieve extremely low on-resistance per silicon area. Combining this technology

with International Rectifier's low forward drop Schottky rectifiers results in an

extremely efficient device suitable for use in a wide variety of portable electronics

applications like cell phone, PDA, etc.

The new Micro8

TM package, with half the footprint area of the standard SO-8, provides

the smallest footprint available in an SOIC outline. This makes the Micro8

TM an ideal

device for applications where printed circuit board space is at a premium. The low

profile (<1.1mm) of the Micro8

TM will allow it to fit easily into extremely thin application

environments such as portable electronics and PCMCIA cards.

PD -91649C

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