CYStech Electronics Corp.

Spec. No. : C884N3

Issued Date : 2014.08.20

Revised Date :

Page No. : 8/ 9

MTB030N04N3

CYStek Product Specification

Recommended wave soldering condition

Product

Peak Temperature

Soldering Time

Pb-free devices

260 +0/-5

C

5 +1/-1 seconds

Recommended temperature profile for IR reflow

Profile feature

Sn-Pb eutectic Assembly

Pb-free Assembly

Average ramp-up rate

(Tsmax to Tp)

3

C/second max.

3

C/second max.

Preheat

100

C

150

C

60-120 seconds

150

C

200

C

60-180 seconds

Time maintained above:

183

C

60-150 seconds

217

C

60-150 seconds

240 +0/-5

C

260 +0/-5

C

Time within 5

C of actual peak

temperature(tp)

10-30 seconds

20-40 seconds

Ramp down rate

6

C/second max.

6

C/second max.

Time 25

C to peak temperature

6 minutes max.

8 minutes max.

Note : All temperatures refer to topside of the package, measured on the package body surface.