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CD4014BMS, CD4021BMS

Chip Dimensions and Pad Layouts

FIGURE 9.

TYPICAL POWER DISSIPATION AS A FUNCTION OF FREQUENCY

SUPPLY VOLTAGE

(VDD) = 15V

10V

10V

5V

CL = 50pF

CL = 15pF

10

2

4

6

8

2

4

6

8

2

4

6

8

2

4

6

1

24

6 8

10

24 6 8

24 6 8

24 6 8

24 6 8

CLOCK INPUT FREQUENCY (fCL) (kHz)

METALLIZATION:

Thickness: 11k

Å

PASSIVATION:

10.4kÅ - 15.6k

BOND PADS:

0.004 inches X 0.004 inches MIN

DIE THICKNESS:

0.0198 inches - 0.0218 inches

Dimensions in parentheses are in millimeters

and are derived from the basic inch dimensions