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AD7776 Scheda tecnica(PDF) 4 Page - Analog Devices |
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AD7776 Scheda tecnica(HTML) 4 Page - Analog Devices |
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4 / 12 page  AD7776/AD7777/AD7778 –4– REV. A ABSOLUTE MAXIMUM RATINGS * (TA = +25 °C unless otherwise noted) VCC to AGND or DGND . . . . . . . . . . . . . . . . . . –0.3 V, +7 V AGND, RTN to DGND . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V CS, RD, WR, CLKIN, DB0–DB9, BUSY/INT to DGND . . . . . . . . . . . . . –0.3 V, V CC + 0.3 V Analog Input Voltage to AGND . . . . . . . –0.3 V, VCC + 0.3 V REFOUT to AGND . . . . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V REFIN to AGND . . . . . . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V Operating Temperature Range All Versions . . . . . . . . . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C DIP Package, Power Dissipation . . . . . . . . . . . . . . . . 875 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75°C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 °C SOIC Packages, Power Dissipation . . . . . . . . . . . . . . 875 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 °C ORDERING GUIDE Temperature No. of Package Model Range Channels Option * AD7776AR –40 °C to +85°C1 RW-24 AD7777AN –40 °C to +85°C4 N-28 AD7777AR –40 °C to +85°C4 RW-28 AD7778AS –40 °C to +85°C8 S-44 *R = SOIC, N = PDIP, S = PQFP PQFP Package, Power Dissipation . . . . . . . . . . . . . . 500 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 95 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 °C *Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PIN CONFIGURATIONS 44-Lead PQFP 7 8 9 10 11 6 5 4 3 2 1 33 32 31 30 29 28 27 26 25 24 23 18 19 20 21 22 17 16 15 14 13 12 39 38 37 36 35 34 44 43 42 41 40 TOP VIEW (Not to Scale) AD7778 NC NC NC NC DB2 DB3 DGND DB4 DB5 DB6 DB7 AIN8 AIN7 AIN6 AIN5 AIN4 AIN3 AIN2 AIN1 AGND REFOUT VCC NC = NO CONNECT 24-Lead SOIC 1 2 24 23 22 10 15 11 12 14 13 21 20 18 17 16 19 9 3 4 5 TOP VIEW (Not to Scale) 7 8 6 AD7776 DB2 DB3 DGND DB4 DB5 DB6 DB7 DB1 DB0 CREFIN AGND RTN REFIN AIN AGND REFOUT VCC DB8 (MSB) DB9 CLKIN BUSY/INT RD WR CS 28-Lead PDIP and SOIC 1 2 24 23 22 10 15 11 12 14 13 21 20 17 16 9 3 4 5 7 8 6 18 19 TOP VIEW (Not to Scale) 28 27 26 25 AD7777 NC NC = NO CONNECT DB2 DB3 DGND DB4 DB5 DB6 DB7 DB1 DB0 DB8 (MSB) DB9 BUSY/INT CREFIN AGND RTN REFIN AGND REFOUT VCC CLKIN RD WR CS AIN4 AIN3 AIN2 AIN1 WARNING! ESD SENSITIVE DEVICE CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7776/AD7777/AD7778 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
Codice articolo simile - AD7776_15 |
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Descrizione simile - AD7776_15 |
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