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ILC7081AIM5-33 Scheda tecnica(PDF) 9 Page - Impala Linear Corporation

Il numero della parte ILC7081AIM5-33
Spiegazioni elettronici  50/100M SOT-23 CMOS RF LDO REGULATORS
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Produttore elettronici  IMPALA [Impala Linear Corporation]
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ILC7081AIM5-33 Scheda tecnica(HTML) 9 Page - Impala Linear Corporation

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50/100mA SOT-23 CMOS RF LDO™ Regulators
Impala Linear Corporation
9
(408) 574-3939
www.impalalinear.com
Sept. 1998
ILC7080/81 1.1
4
5
1
23
Connect CIN between VIN of the ILC7080/81 and the
“GROUND PLANE”.
Keep the ground side of COUT and CNOISE connected to
the “LOCAL GROUND” and not directly to the
“GROUND PLANE”.
On multilayer boards use component side copper for
grounding around the ILC7080/81 and connect back to a
“GROUND PLANE” using vias.
If using a DC-DC converter in your design, use a star
grounding system with separate traces for the power
ground and the control signals. The star should radiate
from where the power supply enters the PCB.
Place all RF LDO related components; ILC7080/81,
input capacitor CIN, noise bypass capacitor CNOISE and
output capacitor COUT as close together as possible.
Keep the output capacitor COUT as close to the
ILC7080/81 as possible with very short traces to the
VOUT and GND pins.
The traces for the related components; ILC7080/81,
input capacitor CIN, noise bypass capacitor CNOISE and
output capacitor COUT can be run with minimum trace
widths close to the LDO.
Maintain a separate “LOCAL GROUND” remote from
the “GROUND PLANE” to ensure a quiet ground near
the LDO.
Figure 9 shows how this circuit can be translated into a
PCB layout.
Figure 8: Recommended application circuit schematic
Label
Part Number
Manufacturer
Description
U1
ILC7081AIM5-30
Impala Linear
100mA RF LDO™
J1
69190-405
Berg
Connector, four position header
CIN
GRM40 Y5V 105Z16
muRata
Ceramic capacitor, 1µF, 16V, SMT
(size 0805)
CNOISE
ECU-V1H103KBV
Panasonic
Ceramic Capacitor, 0.01µF, 16V,
SMT (size 0603)
COUT
GRM42-
6X5R475K10
muRata
Ceramic Capacitor, 4.7µF, 16V, SMT
(size 1206)
Evaluation Board Parts List For Printed Circuit Board Shown Above
1.
2.
3.
4.
1.
2.
3.
4.
Grounding Recommendations
Layout Considerations
Figure 9:
Recommended application circuit layout
(not drawn to scale). Note: ground plane is bottom layer
of PCB and connects to top layer ground connections
through vias


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