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SL12 Scheda tecnica(PDF) 2 Page - Diotec Semiconductor |
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SL12 Scheda tecnica(HTML) 2 Page - Diotec Semiconductor |
2 / 2 page SL12 ... SL13 Characteristics Kennwerte Leakage current Sperrstrom Tj = 25°C Tj = 100°C VR = VRRM VR = VRRM IR IR < 0.2 mA < 6.0 mA Thermal resistance junction to ambient air Wärmewiderstand Sperrschicht – umgebende Luft RthA < 70 K/W 1) Thermal resistance junction to terminal Wärmewiderstand Sperrschicht − Anschluss RthT < 30 K/W 1 Mounted on P.C. board with 25 mm2 copper pads at each terminal Montage auf Leiterplatte mit 25 mm2 Kupferbelag (Lötpad) an jedem Anschluss 2 http://www.diotec.com/ © Diotec Semiconductor AG 120 100 80 60 40 20 0 [%] I FAV Rated forward current versus ambient temperature ) Zul. Richtstrom in Abh. von der Umgebungstemp. ) 1 1 [°C] T A 150 100 50 0 [A] I F Forward characteristics (typical values) Durchlasskennlinien (typische Werte) 10 10 1 10 10 2 -1 -2 0 V F 0.4 0.6 [V] 1.0 T = 25°C j 10 1 10 10 -1 -2 [mA] I r Typ. leakage current vs. reverse voltage Typ. Sperrstrom in Abh. v. d. Sperrspannung 0 40 60 80 100 [%] V RRM T = 25°C j T = 100°C j [pF] [V] C j V R T = 25°C f = 1.0 MHz j Junction capacitance vs. reverse voltage (typical) Sperrschichtkapazität in Abh. v.d. Sperrspg. (typ.) |
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