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NE325S01-T1B Scheda tecnica(PDF) 9 Page - NEC |
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NE325S01-T1B Scheda tecnica(HTML) 9 Page - NEC |
9 / 12 page NE325S01 9 RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. <TYPES OF SURFACE MOUNT DEVICE> For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E). Soldering process Soldering conditions Symbol Infrared ray reflow Peak package’s surface temperature: 230 ˚C or below, IR30-00 Reflow time: 30 seconds or below (210 ˚C or higher), Number of reflow process: 1, Exposure limitNote: None Partial heating method Terminal temperature: 230 ˚C or below, Flow time: 10 seconds or below, Exposure limitNote: None Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 ˚C and relative humidity at 65 % or less. Caution Do not apply more than a single process at once, except for “Partial heating method”. PRECAUTION Avoid high static voltage and electric fields, because this device is Hetero Junction field effect transistor with shottky barrier gate. |
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