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74HC14-Q100 Scheda tecnica(PDF) 3 Page - NXP Semiconductors |
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74HC14-Q100 Scheda tecnica(HTML) 3 Page - NXP Semiconductors |
3 / 21 page 74HC_HCT14_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 19 April 2013 3 of 20 NXP Semiconductors 74HC14-Q100; 74HCT14-Q100 Hex inverting Schmitt trigger 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Functional description [1] H = HIGH voltage level; L = LOW voltage level. (1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND. Fig 4. Pin configuration DIP14, SO14 and TSSOP14 Fig 5. Pin configuration DHVQFN14 $ 9&& < $ $ < < $ $ < < $ *1' < DDD +&4 +&74 DDD *1' 7UDQVSDUHQW WRS YLHZ < $ $ < < $ $ < < $ WHUPLQDO LQGH[DUHD +&4 +&74 Table 2. Pin description Symbol Pin Description 1A to 6A 1, 3, 5, 9, 11, 13 data input 1 1Y to 6Y 2, 4, 6, 8, 10, 12 data output 1 GND 7 ground (0 V) VCC 14 supply voltage Table 3. Function table[1] Input Output nA nY LH HL |
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