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BY229X-600 Scheda tecnica(PDF) 1 Page - General Semiconductor |
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BY229X-600 Scheda tecnica(HTML) 1 Page - General Semiconductor |
1 / 2 page BY229X SERIES FAST SWITCHING PLASTIC RECTIFIER Reverse Voltage - 50 to 600 Volts Forward Current - 8.0 Amperes FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ Glass passivated chip junction ♦ Low leakage, high voltage ♦ High surge current capability ♦ Superfast recovery time, for high efficiency ♦ High temperature soldering guaranteed: 250°C, 0.25" (6.35mm) from case for 10 seconds MECHANICAL DATA Case: JEDEC ITO-220AC fully overmolded plastic body over passivated chip Terminals: Plated lead solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting Position: Any Weight: 0.064 ounce, 1.81 grams Mounting Torque: 5 in. - lbs. max. MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. BY229X BY229X BY229X BY229X SYMBOLS -200 -400 -600 -800 UNITS Maximum recurrent peak reverse voltage VRRM 200 400 600 800 Volts Maximum RMS voltage VRMS 140 280 420 560 Volts Maximum DC blocking voltage VDC 200 400 600 800 Volts Maximum average forward rectified current at TC=100°C I(AV) 8.0 Amps Peak forward surge current 8.3ms single half sine-wave superimposed IFSM 100 Amps on rated load (JEDEC Method) Maximum instantaneous forward voltage at 20A VF 1.85 Volts Maximum DC reverse current TJ=25°C 10.0 at rated DC blocking voltage at TJ=125°C IR 300 µA Maximum reverse recovery time (NOTE 1) trr 145 ns Maximum recovered stored charge (NOTE 2) Qrr 700 nC Maximum slope of reverse recovery current (NOTE 2) dir/dt 60 A/ µs Maximum thermal resistance (NOTE 3) R ΘJC 4.8 °C/W Typical thermal resistance, junction to air R ΘJA 20 °C/W Operating junction and storage temperature range TJ, TSTG -40 to +150 °C RMS Isolation voltage from terminals to heatsink 4500 (NOTE 4) with RH ≤ 30% VISOL 3500 (NOTE 5) Volts 1500 (NOTE 6) NOTES: (1) Reverse recovery test conditions: IF=1A, VR=30V, di/dt=50A/ µs, Irr=10% IRM (2) Qrr test conditions: IF=2A, VR=30V, di/dt=20A/ µs (3) Thermal resistance from junction to case mounted on heatsink with heatsink compound (4) Clip mounting, where lead does not overlap heatsink with 0.110” offset. (5) Clip mounting, where leads do overlap heatsink. (6) Screw mounting, where washer diameter is ≤ 4.9 mm (0.19”). ITO-220AC 0.060 (1.52) 0.405 (10.27) 0.383 (9.72) 0.676 (17.2) 0.646 (16.4) 0.191 (4.85) 0.171 (4.35) 0.600 (15.5) 0.580 (14.5) 0.560 (14.22) 0.530 (13.46) 0.037 (0.94) 0.027 (0.69) 0.140 (3.56) 0.130 (3.30) 0.350 (8.89) 0.330 (8.38) 0.188 (4.77) 0.172 (4.36) 0.110 (2.80) 0.100 (2.54) 0.131 (3.39) 0.122 (3.08) 0.110 (2.80) 0.100 (2.54) 0.022 (0.55) 0.014 (0.36) 0.205 (5.20) 0.195 (4.95) PIN 1 PIN 2 12 PIN DIA. DIA. ADVANCED INFORMATION ADVANCED INFORMATION ADVANCED INFORMATION 10/12/98 Dimensions in inches and (millimeters) |
Codice articolo simile - BY229X-600 |
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Descrizione simile - BY229X-600 |
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