TS5A3159ADBVR datasheet(2/32 Pages) TI1

Il numero della parte	TS5A3159ADBVR

Spiegazioni elettronici	1-廓 SPDT ANALOG SWITCH 5-V/3.3-V SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER

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Produttore elettronici	TI1 [Texas Instruments]

Homepage	http://www.ti.com

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TS5A3159A

SCDS200C – AUGUST 2005 – REVISED MAY 2010

www.ti.com

SUMMARY OF CHARACTERISTICS(1)

2:1 Multiplexer/

Configuration

Demultiplexer

(1 × SPDT)

Number of channels

1

On-state resistance (ron)

1.1

Ω

On-state resistance match (

Δron)

0.1

Ω

On-state resistance flatness (ron(flat))

0.15

Ω

Turn-on/turn-off time (tON/tOFF)

20 ns/15 ns

Break-before-make time (tBBM)

12 ns

Charge injection (QC)

–20 pC

Bandwidth (BW)

100 MHz

OFF isolation (OISO)

–65 dB at 1 MHz

Crosstalk (XTALK)

–66 dB at 1 MHz

Total harmonic distortion (THD)

0.01%

Leakage current (INO(OFF)/INC(OFF))

±20 nA

Power-supply current (I+)

50 nA

Package options

6-pin DBV, DCK, or YZP

(1)

V+ = 5 V, TA = 25°C

ORDERING INFORMATION(1)

ORDERABLE

TOP-SIDE

TA

PACKAGE(2)

PART NUMBER

MARKING(3)

NanoFree™ – WCSP (DSBGA)

Reel of 3000

TS5A3159AYZPR

_ _ _JJ_

0.23-mm Large Bump – YZP (Pb-free)

–40°C to 85°C

SOT (SOT-23) – DBV

Reel of 3000

TS5A3159ADBVR

JAJ_

SOT (SC-70) – DCK(3)

Reel of 3000

TS5A3159ADCKR

JJ_

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

2

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