LM3204

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SNVS351B – JUNE 2005 – REVISED NOVEMBER 2005

Absolute Maximum Ratings

(1) (2)

−0.2V to +6.0V

PGND to SGND

−0.2V to +0.2V

(SGND

−0.2V)

w/6.0V max

SW, BYPOUT

(PGND

−0.2V)

w/6.0V max

−0.2V to +0.2V

Internally Limited

+150°C

Storage Temperature Range

−65°C to +150°C

Maximum Lead Temperature

(Soldering, 10 sec.)

+260°C

Human Body Model

2.0kV

Machine Model

200V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics table.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

(4)

The Human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. (MIL-STD-883 3015.7) The machine

model is a 200pF capacitor discharged directly into each pin. National Semiconductor recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe proper ESD handling techniques can result in damage.

Operating Ratings

(1) (2)

Input Voltage Range

2.7V to 5.5V

Recommended Load Current

PWM Mode

0mA to 300mA

Bypass Mode

0mA to 500mA

−30°C to +125°C

(3)

−30°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics table.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

part/package in the application (

Thermal Properties

Junction-to-Ambient Thermal

100°C/W

Resistance (

(1)

(1)

Junction-to-ambient thermal resistance (

forth in the JEDEC standard JESD51-7. A 1" x 1", 4 layer, 1.5oz. Cu board was used for the measurements.

Copyright © 2005, Texas Instruments Incorporated

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