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LM34925 Scheda tecnica(PDF) 3 Page - Texas Instruments

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Il numero della parte LM34925
Spiegazioni elettronici  Integrated Secondary Side Bias Regulator for Isolated DC-DC Converters
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Produttore elettronici  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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LM34925
www.ti.com
SNVS846E – JUNE 2012 – REVISED DECEMBER 2013
Absolute Maximum Ratings
(1) (2)
VIN, UVLO to RTN
–0.3V to 100V
SW to RTN
–1.5V to VIN +0.3V
SW to RTN (100ns transient)
–5V to VIN +0.3V
BST to VCC
100V
BST to SW
13V
RON to RTN
–0.3V to 100V
VCC to RTN
–0.3V to 13V
FB to RTN
–0.3V to 5V
ESD Rating (Human Body Model(3)
2kV
Lead Temperature (4)
200°C
Storage Temperature Range
–55°C to +150°C
Maximum Junction Temperature
150°C
(1)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(2)
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For verified specifications and test conditions, see the Electrical Characteristics. The
RTN pin is the GND reference electrically connected to the substrate.
(3)
The human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin.
(4)
For detailed information on soldering plastic SO PowerPAD package, refer to the Packaging Data Book. Max solder time not to exceed
4 seconds.
Recommended Operating Conditions
(1)
VIN Voltage
7.5 V to 100 V
Operating Junction Temperature
−40°C to +125°C
(1)
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For verified specifications and test conditions, see the Electrical Characteristics. The
RTN pin is the GND reference electrically connected to the substrate.
Thermal Characteristics
WSON-8
SO PowerPAD-8
UNIT
θJA
Junction-to-ambient thermal resistance
41.3
41.1
°C/W
θJCbot
Junction-to-case (bottom) thermal resistance
3.2
2.4
°C/W
ΨJB
Junction-to-board thermal characteristic parameter
19.2
24.4
°C/W
θJB
Junction-to-board thermal resistance
19.1
30.6
°C/W
θJCtop
Junction-to-case (top) thermal resistance
34.7
37.3
°C/W
ΨJT
Junction-to-top thermal characteristic parameter
0.3
6.7
°C/W
Copyright © 2012–2013, Texas Instruments Incorporated
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