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LM34925 Scheda tecnica(PDF) 3 Page - Texas Instruments |
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LM34925 Scheda tecnica(HTML) 3 Page - Texas Instruments |
3 / 26 page LM34925 www.ti.com SNVS846E – JUNE 2012 – REVISED DECEMBER 2013 Absolute Maximum Ratings (1) (2) VIN, UVLO to RTN –0.3V to 100V SW to RTN –1.5V to VIN +0.3V SW to RTN (100ns transient) –5V to VIN +0.3V BST to VCC 100V BST to SW 13V RON to RTN –0.3V to 100V VCC to RTN –0.3V to 13V FB to RTN –0.3V to 5V ESD Rating (Human Body Model(3) 2kV Lead Temperature (4) 200°C Storage Temperature Range –55°C to +150°C Maximum Junction Temperature 150°C (1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (2) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For verified specifications and test conditions, see the Electrical Characteristics. The RTN pin is the GND reference electrically connected to the substrate. (3) The human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. (4) For detailed information on soldering plastic SO PowerPAD package, refer to the Packaging Data Book. Max solder time not to exceed 4 seconds. Recommended Operating Conditions (1) VIN Voltage 7.5 V to 100 V Operating Junction Temperature −40°C to +125°C (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For verified specifications and test conditions, see the Electrical Characteristics. The RTN pin is the GND reference electrically connected to the substrate. Thermal Characteristics WSON-8 SO PowerPAD-8 UNIT θJA Junction-to-ambient thermal resistance 41.3 41.1 °C/W θJCbot Junction-to-case (bottom) thermal resistance 3.2 2.4 °C/W ΨJB Junction-to-board thermal characteristic parameter 19.2 24.4 °C/W θJB Junction-to-board thermal resistance 19.1 30.6 °C/W θJCtop Junction-to-case (top) thermal resistance 34.7 37.3 °C/W ΨJT Junction-to-top thermal characteristic parameter 0.3 6.7 °C/W Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM34925 |
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