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FQD13N06TM Scheda tecnica(PDF) 1 Page - Fairchild Semiconductor |
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FQD13N06TM Scheda tecnica(HTML) 1 Page - Fairchild Semiconductor |
1 / 8 page November 2013 Thermal Characteristics FQD13N06 N-Channel QFET® MOSFET 60 V, 10 A, 140 mΩ Description ©2000 Fairchild Semiconductor Corporation FQD13N06 Rev. C1 www.fairchildsemi.com 1 This N-Channel enhancement mode power MOSFET is produced using Fairchild Semiconductor’s proprietary planar stripe and DMOS technology. This advanced MOSFET technology has been especially tailored to reduce on-state resistance, and to provide superior switching performance and high avalanche energy strength. These devices are suitable for switched mode power supplies, active power factor correction (PFC), and electronic lamp ballasts. Features • 10 A, 60 V, RDS(on) = 140 mΩ (Max.) @ VGS = 10 V, ID = 5.0 A • Low Gate Charge (Typ. 5.8 nC) • Low Crss (Typ. 15 pF) • 100% Avalanche Tested Absolute Maximum Ratings T C = 25°C unless otherwise noted. D-PAK G S D G S D Symbol Parameter FQD13N06TM Unit RJC Thermal Resistance, Junction to Case, Max. 4.5 oC/W RJA Thermal Resistance, Junction to Ambient (Minimum Pad of 2-oz Copper), Max. 110 Thermal Resistance, Junction to Ambient (*1 in2 Pad of 2-oz Copper), Max. 50 Symbol Parameter FQD13N06TM Unit VDSS Drain-Source Voltage 60 V ID Drain Current - Continuous (TC = 25°C) 10 A - Continuous (TC = 100°C) 6.3 A IDM Drain Current - Pulsed (Note 1) 40 A VGSS Gate-Source Voltage ± 25 V EAS Single Pulsed Avalanche Energy (Note 2) 85 mJ IAR Avalanche Current (Note 1) 10 A EAR Repetitive Avalanche Energy (Note 1) 2.8 mJ dv/dt Peak Diode Recovery dv/dt (Note 3) 7.0 V/ns PD Power Dissipation (TA = 25°C) * 2.5 W Power Dissipation (TC = 25°C) 28 W - Derate above 25°C 0.22 W/°C TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C TL Maximum lead temperature for soldering, 1/8" from case for 5 seconds 300 °C |
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