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HCPL-3140 Scheda tecnica(PDF) 4 Page - AVAGO TECHNOLOGIES LIMITED |
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HCPL-3140 Scheda tecnica(HTML) 4 Page - AVAGO TECHNOLOGIES LIMITED |
4 / 16 page 4 Solder Reflow Temperature Profile Regulatory Information The HCPL-3140/HCPL-0314 have been approved by the following organizations: IEC/EN/DIN EN 60747-5-2 Approved under : IEC 60747-5-2:1997 + A1:2002 EN 60747-5-2:2001 + A1:2002 DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01 (Option 060 only) UL Approval under UL 1577, component recognition program up to VISO = 2500 Vrms. File E55361. CSA Approval under CSA Component Acceptance Notice #5, File CA 88324. IEC/EN/DIN EN 60747-5-2 Insulation Characteristics (HCPL-3140 Option 060) Description Symbol Characteristic Unit Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤ 150 Vrms I - IV for rated mains voltage ≤ 300 Vrms I - III for rated mains voltage ≤ 600 Vrms I-II Climatic Classification 55/100/21 Pollution Degree (DIN VDE 0110/1.89) 2 Maximum Working Insulation Voltage VIORM 630 Vpeak Input to Output Test Voltage, Method b* VIORM x 1.875=VPR, 100% Production Test with VPR 1181 Vpeak tm=1 sec, Partial discharge < 5 pC Input to Output Test Voltage, Method a* VIORM x 1.5=VPR, Type and Sample Test, tm=60 sec, VPR 945 Vpeak Partial discharge < 5 pC Highest Allowable Overvoltage VIOTM 6000 Vpeak (Transient Overvoltage tini = 10 sec) Safety-limiting values - maximum values allowed in the event of a failure. Case Temperature TS 175 °C Input Current** IS,INPUT 230 mA Output Power** PS,OUTPUT 600 mW Insulation Resistance at TS, VIO = 500 V RS >109 Ω * Refer to the optocoupler section of the Isolation and Control Components Designer’s Catalog, under Product Safety Regulations section IEC/EN/ DIN EN 60747-5-2 for a detailed description of Method a and Method b partial discharge test profiles. ** Refer to the following figure for dependence of PS and IS on ambient temperature. 0 TIME (SECONDS) 200 100 50 150 100 200 250 300 0 30 SEC. 50 SEC. 30 SEC. 160°C 140°C 150°C PEAK TEMP. 245°C PEAK TEMP. 240°C PEAK TEMP. 230°C SOLDERING TIME 200°C PREHEATING TIME 150°C, 90 + 30 SEC. 2.5°C ± 0.5°C/SEC. 3°C + 1°C/–0.5°C TIGHT TYPICAL LOOSE ROOM TEMPERATURE PREHEATING RATE 3°C + 1°C/–0.5°C/SEC. REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. Recommended Pb-Free IR Profile 217 °C RAMP-DOWN 6 °C/SEC. MAX. RAMP-UP 3 °C/SEC. MAX. 150 - 200 °C 260 +0/-5 °C t 25 °C to PEAK 60 to 150 SEC. 20-40 SEC. TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE tp ts PREHEAT 60 to 180 SEC. tL TL Tsmax Tsmin 25 Tp TIME NOTES: THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 °C, Tsmin = 150 °C Note: Non-halide flux should be used. Note: Non-halide flux should be used. |
Codice articolo simile - HCPL-3140 |
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Descrizione simile - HCPL-3140 |
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