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CS8101YDR8 Scheda tecnica(PDF) 7 Page - Cherry Semiconductor Corporation |
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CS8101YDR8 Scheda tecnica(HTML) 7 Page - Cherry Semiconductor Corporation |
7 / 8 page 7 8 Lead 20 Lead 5 Lead Thermal Data SOIC SOIC Wide TO-220 RQJC typ 45 9 3.3 ûC/W RQJA typ 165 55 50 ûC/W Package Specification PACKAGE DIMENSIONS IN mm (INCHES) PACKAGE THERMAL DATA D Lead Count Metric English Max Min Max Min 8L SOIC 5.00 4.80 .197 .189 20L SOIC 13.00 12.60 .512 .496 1.27 (.050) BSC 0.51 (.020) 0.33 (.013) 6.20 (.244) 5.80 (.228) 4.00 (.157) 3.80 (.150) 1.57 (.062) 1.37 (.054) D 0.25 (0.10) 0.10 (.004) 1.75 (.069) MAX 1.27 (.050) 0.40 (.016) REF: JEDEC MS-012 0.25 (.010) 0.19 (.008) Surface Mount Narrow Body (D); 150 mil wide 1.27 (.050) BSC 7.60 (.299) 7.40 (.291) 10.65 (.419) 10.00 (.394) D 0.32 (.013) 0.23 (.009) 1.27 (.050) 0.40 (.016) REF: JEDEC MS-013 2.49 (.098) 2.24 (.088) 0.51 (.020) 0.33 (.013) 2.65 (.104) 2.35 (.093) 0.30 (.012) 0.10 (.004) Surface Mount Wide Body (DW); 300 mil wide |
Codice articolo simile - CS8101YDR8 |
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Descrizione simile - CS8101YDR8 |
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