IRF6691PbF

www.irf.com

3

PROVISIONAL

Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient

back and with small clip heatsink.

Notes:

ƒ Surface mounted on 1 in. square Cu

(still air).

‰ Mounted to a PCB with

small clip heatsink (still air)

Š Mounted on minimum

footprint full size board with

metalized back and with small

clip heatsink (still air)

A bsolute M axim um R atings

P ower Dissipation

e

P ower Dissipation

e

W

P ower Dissipation

f

P eak S oldering Tem perature

°C

O perating Junction and

S torage Tem perature Range

Therm al R esistance

Param eter

Typ.

M ax.

U nits

Junction-to-Am bient

em

–––

45

Junction-to-Am bient

km

12.5

–––

Junction-to-Am bient

lm

20

–––

°C/W

Junction-to-Case

fm

–––

1.4

Junction-to-PCB M ounted

1.0

–––

Linear Derating Factor

e

W/°C

0.022

-40 to + 150

2.8

270

1.8

89

1E-006

1E-005

0.0001

0.001

0.01

0.1

1

10

100

t1 , Rectangular Pulse Duration (sec)

0.0001

0.001

0.01

0.1

1

10

100

0.20

0.10

D = 0.50

0.02

0.01

0.05

SINGLE PULSE

( THERMAL RESPONSE )

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = P dm x Zthja + Tc

τ

J

τ

J

τ

1

τ

1

τ

2

τ

2

τ

3

τ

3

R

1

R

1

R

2

R

2

R

3

R

3

Ci=

τi/Ri

Ci=

τi/Ri

τ

A

τ

A

τ

4

τ

4

R

4

R

4

Ri (°C/W)

τi (sec)

0.678

0.000860

17.30

0.577560

17.57

8.940000

9.470

106.0000