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LMZ31506HRUQT Scheda tecnica(PDF) 3 Page - Texas Instruments |
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LMZ31506HRUQT Scheda tecnica(HTML) 3 Page - Texas Instruments |
3 / 30 page LMZ31506H www.ti.com SNVS996 – JULY 2013 THERMAL INFORMATION LMZ31506H THERMAL METRIC(1) RUQ47 UNITS 47 PINS θJA Junction-to-ambient thermal resistance(2) 13 θJCtop Junction-to-case (top) thermal resistance(3) 9 θJB Junction-to-board thermal resistance(4) 6 °C/W ψJT Junction-to-top characterization parameter(5) 2.5 ψJB Junction-to-board characterization parameter(6) 5 θJCbot Junction-to-case (bottom) thermal resistance(7) 3.8 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC- standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). (7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Spacer PACKAGE SPECIFICATIONS LMZ31506H UNIT Weight 1.26 grams Flammability Meets UL 94 V-O MTBF Calculated reliability Per Bellcore TR-332, 50% stress, TA = 40°C, ground benign 33.9 MHrs Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LMZ31506H |
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