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LM2676S-5.0 Scheda tecnica(PDF) 4 Page - Texas Instruments

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Il numero della parte LM2676S-5.0
Spiegazioni elettronici  LM2676 SIMPLE SWITCHER High Efficiency 3A Step-Down Voltage Regulator
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LM2676
SNVS031J – APRIL 2000 – REVISED APRIL 2013
www.ti.com
All Output Voltage Versions
Electrical Characteristics
Limits appearing in bold type face apply over the entire junction temperature range of operation,
−40°C to 125°C.
Specifications appearing in normal type apply for TA = TJ = 25°C. Unless otherwise specified VIN=12V for the 3.3V, 5V and
Adjustable versions and VIN=24V for the 12V version.
Symbol
Parameter
Conditions
Typ
Min
Max
Units
DEVICE PARAMETERS
IQ
Quiescent Current
VFEEDBACK = 8V
4.2
6
mA
For 3.3V, 5.0V, and ADJ Versions
VFEEDBACK = 15V
For 12V Versions
ISTBY
Standby Quiescent
ON/OFF Pin = 0V
50
100/150
μA
Current
ICL
Current Limit
4.5
3.8/3.6
5.25/5.4
A
IL
Output Leakage
VIN = 40V, ON/OFF Pin = 0V
μA
Current
VSWITCH = 0V
200
mA
VSWITCH = −1V
16
15
RDS(ON)
Switch On-
ISWITCH = 3A
0.15
0.17/0.29
Ω
Resistance
fO
Oscillator
Measured at Switch Pin
260
225
280
kHz
Frequency
D
Duty Cycle
Maximum Duty Cycle
91
%
Minimum Duty Cycle
0
%
IBIAS
Feedback Bias
VFEEDBACK = 1.3V
85
nA
Current
ADJ Version Only
VON/OFF
ON/OFF Threshold
1.4
0.8
2.0
V
Voltage
ION/OFF
ON/OFF Input
ON/OFF Input = 0V
20
45
μA
Current
θJA
Thermal
NDZ Package, Junction to Ambient(1)
65
Resistance
θJA
NDZ Package, Junction to Ambient(2)
45
θJC
NDZ Package, Junction to Case
2
θJA
KTW Package, Junction to Ambient(3)
56
°C/W
θJA
KTW Package, Junction to Ambient(4)
35
θJA
KTW Package, Junction to Ambient(5)
26
θJC
KTW Package, Junction to Case
2
++
θJA
NHM Package, Junction to Ambient(6)
55
°C/W
θJA
NHM Package, Junction to Ambient(7)
29
(1)
Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads in a
socket, or on a PC board with minimum copper area.
(2)
Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads
soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
(3)
Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board area of 0.136 square inches (the
same size as the DDPAK package) of 1 oz. (0.0014 in. thick) copper.
(4)
Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board area of 0.4896 square inches
(3.6 times the area of the DDPAK package) of 1 oz. (0.0014 in. thick) copper.
(5)
Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board copper area of 1.0064 square
inches (7.4 times the area of the DDPAK package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal
resistance further. See the thermal model in Switchers Made Simple® software.
(6)
Junction to ambient thermal resistance for the 14-lead VSON mounted on a PC board copper area equal to the die attach paddle.
(7)
Junction to ambient thermal resistance for the 14-lead VSON mounted on a PC board copper area using 12 vias to a second layer of
copper equal to die attach paddle. Additional copper area will reduce thermal resistance further. For layout recommendations, refer to
Application Note AN-1187 at www.ti.com/lsds/ti/analog/powermanagement/power_portal.page.
4
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