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2PA1774SMB Scheda tecnica(PDF) 4 Page - NXP Semiconductors |
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2PA1774SMB Scheda tecnica(HTML) 4 Page - NXP Semiconductors |
4 / 12 page 2PA1774XMB_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 — 23 March 2012 4 of 12 NXP Semiconductors 2PA1774xMB series 40 V, 100 mA PNP general-purpose transistors 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB, single-sided copper, mounting pad for collector 1 cm2. Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air [1][2] - - 500 K/W [3][2] - - 212 K/W FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aab603 10−5 10 10−2 10−4 102 10−1 tp (s) 10−3 103 1 102 10 103 Zth(j-a) (K/W) 1 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0 |
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