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AM29LV004B-150FE Scheda tecnica(PDF) 8 Page - Advanced Micro Devices

Il numero della parte AM29LV004B-150FE
Spiegazioni elettronici  4 Megabit (512 K x 8-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory
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Produttore elettronici  AMD [Advanced Micro Devices]
Homepage  http://www.amd.com
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Am29LV004
PR EL I M I NAR Y
Standby Mode
When the system is not reading or writing to the device,
it can place the device in the standby mode. In this
mode, current consumption is greatly reduced, and the
outputs are placed in the high impedance state, inde-
pendent of the OE# input.
The device enters the CMOS standby mode when the
CE# and RESET# pins are both held at VCC ± 0.3 V.
(Note that this is a more restricted voltage range than
VIH.) If CE# and RESET# are held at VIH, but not within
VCC ± 0.3 V, the device will be in the standby mode, but
the standby current will be greater. The device requires
standard access time (tCE) for read access when the
device is in either of these standby modes, before it is
ready to read data.
If the device is deselected during erasure or program-
min g, the d evice dra ws active current u ntil th e
operation is completed.
In the DC Characteristics tables, ICC3 and ICC4 repre-
sents the standby current specification.
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device
en ergy co nsu mp tion . The d evice au tomat ic ally
enables this mode when addresses remain stable for
tACC + 30 ns. The automatic sleep mode is indepen-
dent of the CE#, WE#, and OE# control signals. Stan-
dard address access timings provide new data when
addresses are changed. While in sleep mode, output
data is latched and always available to the system. ICC5
in the DC Characteristics table represents the auto-
matic sleep mode current specification.
RESET#: Hardware Reset Pin
The RESET# pin provides a hardware method of reset-
ting the device to reading array data. When the RE-
SET# pin is driven low for at least a period of tRP, the
device immediately terminates any operation in
progress, tristates all output pins, and ignores all
read/write commands for the duration of the RESET#
pulse. The device also resets the internal state ma-
chine to reading array data. The operation that was in-
terrupted should be reinitiated once the device is ready
to accept another command sequence, to ensure data
integrity.
Current is reduced for the duration of the RESET#
pulse. When RESET# is held at VSS±0.3 V, the device
draws CMOS standby current (ICC4). If RESET# is held
at VIL but not within VSS±0.3 V, the standby current will
be greater.
The RESET# pin may be tied to the system reset cir-
cuitry. A system reset would thus also reset the Flash
memory, enabling the system to read the boot-up firm-
ware from the Flash memory.
If RESET# is asserted during a program or erase op-
eration, the RY/BY# pin remains a “0” (busy) until the
internal reset operation is complete, which requires a
time of tREADY (during Embedded Algorithms). The
syst em can thu s monito r RY/BY# to det ermine
whether the reset operation is complete. If RESET# is
asserted when a program or erase operation is not ex-
ecuting (RY/BY# pin is “1”), the reset operation is
completed within a time of tREADY (not during Embed-
ded Algorithms). The system can read data tRH after
the RESET# pin returns to VIH.
Refer to the AC Characteristics tables for RESET# pa-
rameters and to Figure 13 for the timing diagram.
Output Disable Mode
When the OE# input is at VIH, output from the device is
disabled. The output pins are placed in the high imped-
ance state.


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