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TLP785 Scheda tecnica(PDF) 8 Page - Toshiba Semiconductor

Il numero della parte TLP785
Spiegazioni elettronici  Office Equipment Household Appliances
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Produttore elettronici  TOSHIBA [Toshiba Semiconductor]
Homepage  http://www.semicon.toshiba.co.jp/eng
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TLP785 Scheda tecnica(HTML) 8 Page - Toshiba Semiconductor

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TLP785,TLP785F
2012-02-20
8
Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
·Temperature profile example of lead (Pb) solders
·Temperature profile example of using lead (Pb)-free solders
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
Please preheat it at 150°C between 60 and 120 seconds.
Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin
may be heated at most once.
Time
(s)
(°C)
240
210
160
60 to 120s
less than 30s
140
Time
(s)
(°C)
260
230
190
60 to 120s
30 to 50s
180
This profile is based on the devices
maximum heat resistance guaranteed value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type used
by the customer within the described profile.
This profile is based on the devices
maximum heat resistance guaranteed value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type used
by the customer within the described profile.


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