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TS310223 Scheda tecnica(PDF) 8 Page - List of Unclassifed Manufacturers |
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TS310223 Scheda tecnica(HTML) 8 Page - List of Unclassifed Manufacturers |
8 / 16 page - 8 - TS31023/223 Version 1.1 Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE APPLICATION USING A MULTI-LAYER PCB To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed when laying out this part on the PCB. The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane. JEDEC standard FR4 PCB Cross-section: Multi-Layer Board (Cross-sectional View) In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias, thickness of copper, etc. Package Thermal Pad Solder Pad (Land Pattern) Thermal Via's Package Outline Package and PCB Land Configuration For a Multi-Layer PCB (square) Package Solder Pad Package Solder Pad (bottom trace) Thermal Via Component Traces Thermal Isolation Power plane only 1.5748mm 0.0 - 0.071 mm Board Base & Bottom Pad 0.5246 - 0.5606 mm Power Plane (1oz Cu) 1.0142 - 1.0502 mm Ground Plane (1oz Cu) 1.5038 - 1.5748 mm Component Trace (2oz Cu) 2 Plane 4 Plane |
Codice articolo simile - TS310223 |
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Descrizione simile - TS310223 |
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