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LM2825N-5.0 Scheda tecnica(PDF) 5 Page - Texas Instruments |
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LM2825N-5.0 Scheda tecnica(HTML) 5 Page - Texas Instruments |
5 / 21 page LM2825 www.ti.com SNVS127C – MAY 1997 – REVISED APRIL 2013 All Output Voltage Versions Electrical Characteristics Specifications with standard type face are for TA = 25°C, and those with boldface type apply over full Operating Range. Unless otherwise specified, VIN = 12V for 3.3V, 5.0V and ADJ versions, VIN = 24V for 12V and H-ADJ versions, ILOAD = 100 mA. Symbol Parameter Conditions LM2825-XX Units (Limits) Typical(1) Limit(2) ICL DC Output Current Limit RL = 0Ω 1.4 A 1.2 A(min) 2.4 A(max) IQ Operating Quiescent SD/SS Pin = 3.1V(3) 5 mA Current 10 mA(max) ISTBY Standby Quiescent SD/SS Pin = 0V(3) 65 μA Current 200 μA(max) IADJ Adjust Pin Bias Current Adjustable Versions Only, VFB = 1.3V 6 nA 50/100 nA(max) fO Oscillator Frequency See(4) 150 kHz θJA Thermal Resistance Junction to Ambient(5) 30 °C/W SHUTDOWN/SOFT-START CONTROL Test Circuit, see Figure 17 VSD Shutdown Threshold 1.3 V Voltage Low (Shutdown Mode) 0.6 V(max) High (Soft-start Mode) 2.0 V(min) VSS Soft-start Voltage VOUT = 20% of Nominal Output Voltage 2 V VOUT = 100% of Nominal Output Voltage 3 ISD Shutdown Current VSHUTDOWN = 0.5V (3) 5 μA 10 μA(max) ISS Soft-start Current VSOFT-START = 2.5V (3) 1.6 μA 5 μA(max) (1) Typical numbers are at 25°C and represent the most likely norm. (2) All limits ensured at room temperature (standard type face) and at temperature extremes (bold type face) when output current is limited to the value given in the temperature derating curves. See the Application Information section for curves. All limits at temperature extremes are ensured using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). (3) ILOAD = 0A. (4) The switching frequency is reduced when the second stage current limit is activated. The amount of reduction is determined by the severity of current overload. (5) Junction to ambient thermal resistance (no external heat sink) for the PDIP package with the leads soldered to a printed circuit board with (1 oz.) copper area of approximately 2 in2. Copyright © 1997–2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM2825 |
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