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LM2677S-3.3 Scheda tecnica(PDF) 5 Page - Texas Instruments |
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LM2677S-3.3 Scheda tecnica(HTML) 5 Page - Texas Instruments |
5 / 34 page LM2677 www.ti.com SNVS077I – MAY 2004 – REVISED JUNE 2012 All Output Voltage Versions Electrical Characteristics (continued) Limits appearing in bold type face apply over the entire junction temperature range of operation, −40°C to 125°C. Specifications appearing in normal type apply for TA = TJ = 25°C. Unless otherwise specified VIN=12V for the 3.3V, 5V and Adjustable versions and VIN=24V for the 12V version, Sync pin open circuited.. Symbol Parameter Conditions Typ Min Max Units θJA Thermal NDZ Package, Junction to Ambient(1) 65 °C/W Resistance θJA NDZ Package, Junction to Ambient(2) 45 θJC NDZ Package, Junction to Case 2 θJA KTW Package, Junction to Ambient(3) 56 θJA KTW Package, Junction to Ambient(4) 35 θJA KTW Package, Junction to Ambient(5) 26 θJC KTW Package, Junction to Case 2 ++ θJA NHM Package, Junction to Ambient(6) 55 °C/W θJA NHM Package, Junction to Ambient(7) 29 (1) Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads in a socket, or on a PC board with minimum copper area. (2) Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads. (3) Junction to ambient thermal resistance for the 7 lead DDPAK/TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper. (4) Junction to ambient thermal resistance for the 7 lead DDPAK/TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area of the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper. (5) Junction to ambient thermal resistance for the 7 lead DDPAK/TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times the area of the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal resistance further. See the thermal model in Switchers Made Simple software. (6) Junction to ambient thermal resistance for the 14-lead VSON mounted on a PC board copper area equal to the die attach paddle. (7) Junction to ambient thermal resistance for the 14-lead VSON mounted on a PC board copper area using 12 vias to a second layer of copper equal to die attach paddle. Additional copper area will reduce thermal resistance further. For layout recommendations, refer to Application Note AN-1187 (SNOA401). Copyright © 2004–2012, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM2677 |
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