LS A676, LA A676, LO A676, LY A676

2012-06-15

11

Lötbedingungen

Vorbehandlung nach JEDEC Level 2

Soldering Conditions

Preconditioning acc. to JEDEC Level 2

Reflow Lötprofil für bleifreies Löten

(nach J-STD-020D.01)

Reflow Soldering Profile for lead free soldering

(acc. to J-STD-020D.01)

Anm.: Das Gehäuse ist nicht für nasschemische Reinigung geeignet.

Note: Package not suitable for wetcleaning.

Profile Feature

Pb-Free (SnAgCu) Assembly

Recommendation

Max. Ratings

25°C to 150°C

2 K/ s

3 K / s

Time t

(150°C to 200°C

100 s

min. 60sec max. 120sec

180°C to T

P

2 K/ s

3 K / s

Liquidus Temperture T

L

217°C

Time t

80 s

max. 100 s

Peak Temperature T

P

245 °C

max. 250 °C

Time t

peak temperature T

20 s

min. 10 s max. 30 s

Ramp-down Rate*

T

3 K / s

6 K / s maximum

Time 25°C to Peak temperature

max. 8 min.

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation ∆T/∆t: ∆t max. 5 s; fulfillment for the whole T-range

0

0

s

OHA04525

50

100

150

200

250

300

50

100

150

200

250

300

t

T

˚C

S

t

t

P

t

T

p

240 ˚C

217 ˚C

245 ˚C

25 ˚C

L