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TLP708F Scheda tecnica(PDF) 10 Page - Toshiba Semiconductor

Il numero della parte TLP708F
Spiegazioni elettronici  Factory Automation (FA) Home Electrical Appliances Operates at high ambient temperatures up to 125
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Produttore elettronici  TOSHIBA [Toshiba Semiconductor]
Homepage  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TLP708F Scheda tecnica(HTML) 10 Page - Toshiba Semiconductor

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TLP708,TLP708F
2012-08-07
10
Specifications for Embossed-Tape Packing
(TP) for SDIP6 Type Photocoupler
1. Applicable Package
Package Name
Product Type
SDIP6
Photocouplers
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as
below.
(Example)
TLP708 (TP, F)
[[G]]/RoHS COMPATIBLE (Note 6)
Tape type
Device name
3. Tape Dimensions
3.1
Orientation of Devices in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Figure 1 Device Orientation
3.2
Tape Packing Quantity:
1500 devices per reel
3.3
Empty Device Recesses Are as Shown in Table 1.
Table 1 Empty Device Recesses
Item
Standard
Remarks
Occurrences of 2 or more
successive empty device
recesses
0
Within any given 40-mm section of
tape, not including leader and trailer
Single empty device
recesses
6 devices (max) per reel
Not including leader and trailer
3.4
Start and End of Tape:
The start of the tape has 30 or more empty holes. The end of the tape has 30 or more empty holes and two empty
turns as a cover tape.
Tape feed


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