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TLP708F Scheda tecnica(PDF) 8 Page - Toshiba Semiconductor

Il numero della parte TLP708F
Spiegazioni elettronici  Factory Automation (FA) Home Electrical Appliances Operates at high ambient temperatures up to 125
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Produttore elettronici  TOSHIBA [Toshiba Semiconductor]
Homepage  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TLP708F Scheda tecnica(HTML) 8 Page - Toshiba Semiconductor

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TLP708,TLP708F
2012-08-07
8
PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING &
GENERAL STORAGE
(1) Precautions for Soldering
1) When Using Soldering Reflow
An example of a temperature profile when Sn-Pb eutectic solder is used:
An example of a temperature profile when lead(Pb)-free solder is used:
Reflow soldering should be performed no more than twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering flow (Applicable to both eutectic solder and lead (Pb)-free solder)
Apply preheating of 150
˚C for 60 to 120 seconds.
Mounting condition of 260
˚C or less within 10 seconds is recommended.
Flow soldering should be performed no more than once.
3) When using soldering iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Complete soldering within 10 seconds for lead temperature not exceeding 260
˚C or within 3 seconds
not exceeding 350
˚C.
Heating by soldering iron should be performed no more than once per lead.
( °C )
( °C )


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