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TLP708 Scheda tecnica(PDF) 8 Page - Toshiba Semiconductor |
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TLP708 Scheda tecnica(HTML) 8 Page - Toshiba Semiconductor |
8 / 13 page TLP708,TLP708F 2012-08-07 8 PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING & GENERAL STORAGE (1) Precautions for Soldering 1) When Using Soldering Reflow An example of a temperature profile when Sn-Pb eutectic solder is used: An example of a temperature profile when lead(Pb)-free solder is used: Reflow soldering should be performed no more than twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) When using soldering flow (Applicable to both eutectic solder and lead (Pb)-free solder) Apply preheating of 150 ˚C for 60 to 120 seconds. Mounting condition of 260 ˚C or less within 10 seconds is recommended. Flow soldering should be performed no more than once. 3) When using soldering iron (Applicable to both eutectic solder and Lead(Pb)-Free solder) Complete soldering within 10 seconds for lead temperature not exceeding 260 ˚C or within 3 seconds not exceeding 350 ˚C. Heating by soldering iron should be performed no more than once per lead. ( °C ) ( °C ) |
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