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LM2576 Scheda tecnica(PDF) 10 Page - Texas Instruments |
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LM2576 Scheda tecnica(HTML) 10 Page - Texas Instruments |
10 / 37 page LM2576, LM2576HV SNVS107C – JUNE 1999 – REVISED APRIL 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) (Circuit of Figure 21 and Figure 22) Maximum Power Dissipation (DDPAK/TO-263) Switching Waveforms VOUT = 15V If the DDPAK/TO-263 package is used, the thermal resistance can be A: Output Pin Voltage, 50V/div reduced by increasing the PC board copper area thermally connected B: Output Pin Current, 2A/div to the package. Using 0.5 square inches of copper area, θJA is C: Inductor Current, 2A/div 50°C/W, with 1 square inch of copper area, θJA is 37°C/W, and with D: Output Ripple Voltage, 50 mV/div, 1.6 or more square inches of copper area, θJA is 32°C/W. AC-Coupled Horizontal Time Base: 5 μs/div Figure 18. Figure 19. Load Transient Response Figure 20. 10 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2576 LM2576HV |
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