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CSD19531Q5A Scheda tecnica(PDF) 2 Page - Texas Instruments

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Il numero della parte CSD19531Q5A
Spiegazioni elettronici  100V N-Channel NexFET Power MOSFETs
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Produttore elettronici  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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CSD19531Q5A
SLPS406A – SEPTEMBER 2013 – REVISED JANUARY 2014
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Electrical Characteristics
(TA = 25°C unless otherwise stated)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Static Characteristics
BVDSS
Drain-to-Source Voltage
VGS = 0 V, ID = 250 μA
100
V
IDSS
Drain-to-Source Leakage Current
VGS = 0 V, VDS = 80 V
1
μA
IGSS
Gate-to-Source Leakage Current
VDS = 0 V, VGS = 20 V
100
nA
VGS(th)
Gate-to-Source Threshold Voltage
VDS = VGS, ID = 250 μA
2.2
2.7
3.3
V
VGS = 6 V, ID = 16 A
6.0
7.8
m
RDS(on)
Drain-to-Source On Resistance
VGS = 10 V, ID = 16 A
5.3
6.4
m
gfs
Transconductance
VDS = 10 V, ID = 16 A
82
S
Dynamic Characteristics
Ciss
Input Capacitance
2980
3870
pF
Coss
Output Capacitance
VGS = 0 V, VDS = 50 V, f = 1 MHz
560
728
pF
Crss
Reverse Transfer Capacitance
13.0
16.9
pF
RG
Series Gate Resistance
1.3
2.6
Qg
Gate Charge Total (10 V)
37
48
nC
Qgd
Gate Charge Gate to Drain
6.6
nC
VDS = 50 V, ID = 16 A
Qgs
Gate Charge Gate to Source
10.5
nC
Qg(th)
Gate Charge at Vth
7.3
nC
Qoss
Output Charge
VDS = 50 V, VGS = 0 V
97
nC
td(on)
Turn On Delay Time
6.0
ns
tr
Rise Time
5.8
ns
VDS = 50 V, VGS = 10 V,
IDS = 16 A, RG = 0 Ω
td(off)
Turn Off Delay Time
18.4
ns
tf
Fall Time
5.2
ns
Diode Characteristics
VSD
Diode Forward Voltage
ISD = 16 A, VGS = 0 V
0.8
1
V
Qrr
Reverse Recovery Charge
226
nC
VDS= 50 V, IF = 16 A,
di/dt = 300 A/
μs
trr
Reverse Recovery Time
148
ns
Thermal Characteristics
(TA = 25°C unless otherwise stated)
PARAMETER
MIN
TYP
MAX
UNIT
RθJC
Thermal Resistance Junction to Case(1)
1
°C/W
RθJA
Thermal Resistance Junction to Ambient(1)(2)
50
°C/W
(1)
RθJC is determined with the device mounted on a 1-inch
2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm ×
3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2)
Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.
2
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