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TLP754 Scheda tecnica(PDF) 1 Page - Toshiba Semiconductor

Il numero della parte TLP754
Spiegazioni elettronici  Photocouplers GaA As Infrared LED & Photo IC
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Produttore elettronici  TOSHIBA [Toshiba Semiconductor]
Homepage  http://www.semicon.toshiba.co.jp/eng
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TLP754
1
Photocouplers GaAℓAs Infrared LED & Photo IC
TLP754
TLP754
TLP754
TLP754
1.
1.
1.
1. Applications
Applications
Applications
Applications
Intelligent Power Module Signal Isolation
Factory Automation (FA)
Transistor Inverters
2.
2.
2.
2. General
General
General
General
The TLP754 is a photocoupler in a DIP8 package that consists of a GaAℓAs infrared light-emitting diode (LED)
optically coupled to an integrated high-gain, high-speed photodetector IC chip. It provides guaranteed performance
and specifications at temperatures up to 125.
An internal noise shield provides a guaranteed commonmode transient immunity of 20 kV/µs. The TLP754
guarantees minimum and maximum of propagation delay time, pulse width distortion. Therefore it is suitable
for isolation interface between IPM and control IC circuits in motor control application.
3.
3.
3.
3. Features
Features
Features
Features
(1)
Inverter logic type (open collector output)
(2)
Package: DIP8
(3)
Operating temperature: -40 to 125
(4)
Supply voltage: -0.5 to 30 V
(5)
Threshold input current: 5.0 mA (max)
(6)
Supply current: 1.3 mA (max)
(7)
Propagation delay time: tpHL = 400 ns (max), tpLH = 550 ns (max)
(8)
Pulse width distortion: |tpHL - tpLH| = 400 ns (max)
(9)
Common-mode transient immunity: ±20 kV/µs (min)
(10) Isolation voltage: 5000 Vrms (min)
(11) Safety standards
UL-approved: UL1577 File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A, File No.E67349
VDE-approved: Option (D4) EN60747-5-2
4.
4.
4.
4. Packaging and Pin Configuration
Packaging and Pin Configuration
Packaging and Pin Configuration
Packaging and Pin Configuration
1: N.C.
2: Anode
3: Cathode
4: N.C.
5: GND
6: VO (Output)
7: N.C.
8: VCC
11-10C4S
2012-02-02
Rev.2.0


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