HCPL-270L datasheet(5/12 Pages) AVAGO

Il numero della parte	HCPL-270L

Spiegazioni elettronici	Low Input Current, High Gain, LVTTL/LVCMOS Compatbie Optocouplers

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Produttore elettronici	AVAGO [AVAGO TECHNOLOGIES LIMITED]

Homepage	http://www.avagotech.com

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5

Solder Reflow Temperature Profile

Recommended Pb-Free IR Profile

Note: Non-halide flux should be used.

Regulatory Information

The devices contained in this data sheet have been approved by the following organizations:

UL Approval under UL 1577, Component Recognition Program, File E55361.

CSA Approval under CSA Component Acceptance Notice #5, File CA 88324.

IEC/EN/DIN EN 60747-5-2

Approved under

IEC 60747-5-2:1997 + A1:2002

EN 60747-5-2:2001 + A1:2002

DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01 (Option 060 only)

217°C

RAMP-DOWN

6°C/SEC.MAX.

RAMP-UP

3°C/SEC.MAX.

150-200°C

260+0/-5°C

t25°CtoPEAK

60to150SEC.

20-40SEC.

TIMEWITHIN5°CofACTUAL

PEAKTEMPERATURE

tp

ts

PREHEAT

60to180SEC.

tL

TL

Tsmax

Tsmin

25

Tp

TIME

NOTES:

THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.

Tsmax= 200 °C, Tsmin= 150 °C

0

TIME (SECONDS)

200

100

50

150

100

200

250

300

0

30

SEC.

50 SEC.

30

SEC.

160°C

140°C

150°C

PEAK

TEMP.

245°C

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

PREHEATING TIME

150°C, 90 + 30 SEC.

2.5°C ± 0.5°C/SEC.

3°C + 1°C/-0.5°C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3°C + 1°C/-0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.

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