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HCPL-7721-060E Scheda tecnica(PDF) 5 Page - AVAGO TECHNOLOGIES LIMITED

Il numero della parte HCPL-7721-060E
Spiegazioni elettronici  40 ns Propagation Delay, CMOS Optocoupler
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Produttore elettronici  AVAGO [AVAGO TECHNOLOGIES LIMITED]
Homepage  http://www.avagotech.com
Logo AVAGO - AVAGO TECHNOLOGIES LIMITED

HCPL-7721-060E Scheda tecnica(HTML) 5 Page - AVAGO TECHNOLOGIES LIMITED

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All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These
dimensions are needed as a starting point for the equip-
ment designer when determining the circuit insulation
requirements. However, once mounted on a printed
circuit board, minimum creepage and clearance require-
ments must be met as specified for individual equipment
standards. For creepage, the shortest distance path along
Insulation and Safety Related Specifications
Value
Parameter
Symbol
772X
072X
Units
Conditions
Minimum External Air
L(I01)
7.1
4.9
mm
Measured from input terminals to output
Gap (Clearance)
terminals, shortest distance through air.
Minimum External
L(I02)
7.4
4.8
mm
Measured from input terminals to output
Tracking (Creepage)
terminals, shortest distance path along body.
Minimum Internal Plastic
0.08
0.08
mm
Insulation thickness between emitter and
Gap (Internal Clearance)
detector; also known as distance through
insulation.
Tracking Resistance
CTI
≥175
≥175
Volts
DIN IEC 112/VDE 0303 Part 1
(Comparative Tracking
Index)
Isolation Group
IIIa
IIIa
Material Group
(DIN VDE 0110, 1/89, Table 1)
the surface of a printed circuit board between the solder
fillets of the input and output leads must be considered.
There are recommended techniques such as grooves
and ribs which may be used on a printed circuit board to
achieve desired creepage and clearances. Creepage and
clearance distances will also change depending on fac-
tors such as pollution degree and insulation level.
Regulatory Information
The HCPL-772X/072X have been approved by the following organizations:
UL
Recognized under UL 1577, component recognition program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5, File CA88324.
IEC/EN/DIN EN 60747-5-5
Solder Reflow Thermal Profile
Recommended reflow condition as per JEDEC Standard, J-STD-020 (latest revision). Non-
Halide Flux should be used.


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