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CXXXDA700-SXX000 Scheda tecnica(PDF) 2 Page - Cree, Inc |
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CXXXDA700-SXX000 Scheda tecnica(HTML) 2 Page - Cree, Inc |
2 / 5 page Copyright©2011Cree,Inc.Allrightsreserved.Theinformationinthisdocumentissubjecttochangewithoutnotice.Creeandthe Creelogoareregisteredtrademarks,andDAandDA700aretrademarksofCree,Inc. 2 CPR3EU Rev. - Cree,Inc. 4600SiliconDrive Durham,NC27703 USATel:+1.919.313.5300 www.cree.com Maximum Ratings at T A = 25°C Notes 1, 2 & 3 CxxxDA700-Sxx000 DCForwardCurrent 750mA PeakForwardCurrent(1/10dutycycle@1kHz) 1000mA LEDJunctionTemperature 150°C ReverseVoltage 5V OperatingTemperatureRange -40°Cto+100°C StorageTemperatureRange -40°Cto+100°C Typical Electrical/Optical Characteristics at T A = 25°C, If = 350 mA Note 2 Part Number Forward Voltage (V f, V) Reverse Current [I(Vr=5V), μA] Full Width Half Max ( λ D, nm) Min. Typ. Max. Max. Typ. C450DA700-Sxx000 2.9 3.3 3.5 2 20 C460DA700-Sxx000 2.9 3.3 3.5 2 21 Mechanical Specifications CxxxDA700-Sxx000 Description Dimension Tolerance P-NJunctionArea(μm) 645x645 ±35 ChipBottomArea(μm) 700x700 ±35 ChipTopArea(μm) 340x340 ±35 ChipThickness(μm) 335 ±25 AuSnBondPadWidth–Anode(um) 75 ±15 AuSnBondPadLength–Anode(um) 645 ±35 AuSnBondPadWidth–Cathode(um) 495 ±35 AuSnBondPadLength–Cathode(um) 645 ±35 BondPadGap(μm) 75 ±15 AuSnBondPadThickness(μm) 3 ±0.5 Notes: 1. Maximum ratings are package-dependent. The above ratings were determined using a Cree 3.45-mm x 3.45-mm SMT package (with silicone encapsulation and intrinsic AuSn metal die attach) for characterization. Ratings for other packages may differ. Junction temperature should be characterizedinaspecificpackagetodeterminelimitations.Assemblyprocessingtemperaturemustnotexceed325°C(<5seconds). 2. Allproductsconformtothelistedminimumandmaximumspecificationsforelectricalandopticalcharacteristicswhenassembledandoperatedat350 mAwithinthemaximumratingsshownabove.Efficiencydecreasesathighercurrents.Typicalvaluesgivenarewithintherangeofaveragevalues expectedbymanufacturerinlargequantitiesandareprovidedforinformationonly.AllmeasurementsweremadeusinglampsinT-1¾packages(with HysolOS4000epoxyencapsulantandintrinsicAuSnmetaldieattach).OpticalcharacteristicsmeasuredinanintegratingsphereusingIlluminanceE. 3. ThemaximumforwardcurrentisdeterminedbythethermalresistancebetweentheLEDjunctionandambient.Itiscrucialfortheend-producttobe designedinamannerthatminimizesthethermalresistancefromtheLEDjunctiontoambientinordertooptimizeproductperformance. 0 100 200 300 400 500 600 700 800 25 50 75 100 125 150 175 Ambient Temperature ( C) Rth j-a = 10 C/W Rth j-a = 15 C/W Rth j-a = 20 C/W Rth j-a = 25 C/W |
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