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AD9279 Scheda tecnica(PDF) 9 Page - Analog Devices |
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AD9279 Scheda tecnica(HTML) 9 Page - Analog Devices |
9 / 44 page AD9279 Rev. 0 | Page 9 of 44 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating AVDD1 to GND −0.3 V to +2.0 V AVDD2 to GND −0.3 V to +3.9 V DRVDD to GND −0.3 V to +2.0 V GND to GND −0.3 V to +0.3 V AVDD2 to AVDD1 −2.0 V to +3.9 V AVDD1 to DRVDD −2.0 V to +2.0 V AVDD2 to DRVDD −2.0 V to +3.9 V Digital Outputs (DOUTx+, DOUTx−, DCO+, DCO−, FCO+, FCO−) to GND −0.3 V to DRVDD + 0.3 V CLK+, CLK−, SDIO to GND −0.3 V to AVDD1 + 0.3 V LI-x, LO-x, LOSW-x to GND −0.3 V to AVDD2 + 0.3 V CWI−, CWI+, CWQ−, CWQ+ to GND −0.3 V to AVDD2 + 0.3 V PDWN, STBY, SCLK, CSB to GND −0.3 V to AVDD1 + 0.3 V GAIN+, GAIN−, RESET, 4LO+, 4LO−, GPO0, GPO1, GPO2, GPO3 to GND −0.3 V to AVDD2 + 0.3 V VREF to GND −0.3 V to AVDD1 + 0.3 V Operating Temperature Range (Ambient) −40°C to +85°C Storage Temperature Range (Ambient) −65°C to +150°C Maximum Junction Temperature 150°C Lead Temperature (Soldering, 10 sec) 300°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL IMPEDANCE Table 5. Symbol Description Value1 Units θ JA Junction-to-ambient thermal resistance, 0.0 m/s air flow per JEDEC JESD51-2 (still air) 22.0 °C/W Ψ JB Junction-to-board thermal characterization parameter, 0 m/s air flow per JEDEC JESD51-8 (still air) 9.2 °C/W Ψ JT Junction-to-top-of-package characterization parameter, 0 m/s air flow per JEDEC JESD51-2 (still air) 0.12 °C/W 1 Results are from simulations. PCB is JEDEC multilayer. Thermal performance for actual applications requires careful inspection of the conditions in the application to determine if they are similar to those assumed in these calculations. ESD CAUTION |
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