SCALE Driver

2SD106AI Data Sheet

IGBT-Driver.com

Page 7

Operating Conditions

Operating conditions

Test conditions

min max

unit

Operating temperature

(see Note 10)

-40 +85

°C

Storage temperature

-40 +90

°C

Footnotes to the key data

1)

The drivers have a zener diode on each channel for over-voltage protection. When the feed voltage

exceeds 16V, this protection can be subject to thermal overload.

2)

If the specified power consumption is exceeded, this indicates an overload of the DC/DC converter.

It should be noted that these DC/DC converters are not protected against overload.

3)

This should be considered as a recommended value. Please consult the section: “Output power

and self-heating”.

4)

Under-voltage monitoring for protecting the power semiconductors. The voltage refers to the local

supply voltage of each individual drive channel. However, this corresponds approximately to the

voltage at VDC with respect to GND.

5)

The input levels must never exceed the limits of the supply voltage (i.e. between GND and VDD),

otherwise latch-up of the integrated circuits LDI 00I can occur. Particular care must be taken when

driving via cables or longer leads.

6)

The gate current must be limited to its maximum value by a gate resistor.

7)

At a load of 39nF in series with 5.6

(typical load of a 1200V/100A IGBT).

8)

Maximum continuous or repeatedly-applied DC voltage between all inputs and all outputs.

However, types that have been measured and selected for higher partial-discharge voltages (e.g.

for 1700V IGBT modules) are also available.

9)

This specification guarantees that the drive information will be transferred reliably even at a high

DC-link voltage and fastest switching operations.

10)

The application-specific self-heating of the drivers - specially at high load - must be taken into

account.

11)

The test voltage of 4000 Vac(rms)/50Hz may be applied only once during a minute. It should be

noted that with this (strictly speaking obsolete) test method, some (minor) damage occurs to the

isolation layers due to the partial discharge. Consequently, this test is not performed at CONCEPT

as a series test. In the case of repeated isolation tests (e.g. module test, equipment test, system

test) the subsequent tests should be performed with a lower test voltage: the test voltage is

reduced by 400V for each additional test. The more modern if more elaborate partial-discharge

measurement is better suited than such test methods as it is almost entirely non-destructive.

12)

The typical blocking time after an error is 1 second. If required, versions with other blocking times

may also be supplied.