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SM15T33CAY Scheda tecnica(PDF) 5 Page - STMicroelectronics |
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SM15T33CAY Scheda tecnica(HTML) 5 Page - STMicroelectronics |
5 / 12 page SM15TY Characteristics Doc ID 17865 Rev 3 5/12 Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 9. Leakage current versus junction temperature (typical values) Figure 10. Peak forward voltage drop versus peak forward current (typical values) I (nA) R 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 25 50 75 100 125 150 T (°C) j V= V RRM V < 10 V RM V10 V RM ≥ 0.1 1.0 10.0 100.0 0.0 0.5 1.0 1.5 2.0 2.5 V (V) FM I (A) FM T = 25 °C j T = 125 °C j 0.01 0.10 1.00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Recommended pad layout Single pulse printed circuit board, copper thickness = 35 µm Z/R th(j-a) th(j-a) t (s) p |
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