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LM2735YMF Scheda tecnica(PDF) 5 Page - Texas Instruments |
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LM2735YMF Scheda tecnica(HTML) 5 Page - Texas Instruments |
5 / 58 page LM2735 www.ti.com SNVS485F – JUNE 2007 – REVISED APRIL 2013 Electrical Characteristics Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature range of (TJ = - 40°C to 125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. VIN = 5V unless otherwise indicated under the Conditions column. Symbol Parameter Conditions Min Typ Max Units −40°C ≤ to TJ ≤ +125°C (SOT-23) 1.230 1.255 1.280 0°C ≤ to TJ ≤ +125°C (SOT-23) 1.236 1.255 1.274 −40°C ≤ to TJ ≤ +125°C (WSON) 1.225 1.255 1.285 VFB Feedback Voltage V −0°C ≤ to TJ ≤ +125°C (WSON) 1.229 1.255 1.281 −40°C ≤ to TJ ≤ +125°C 1.220 1.255 1.290 (MSOP-PowerPAD) 0°C ≤ to TJ ≤ +125°C (MSOP-PowerPAD) 1.230 1.255 1.280 ΔVFB/VIN Feedback Voltage Line Regulation VIN = 2.7V to 5.5V 0.06 %/V IFB Feedback Input Bias Current 0.1 1 µA LM2735-X 1200 1600 2000 kHz FSW Switching Frequency LM2735-Y 360 520 680 LM2735-X 88 96 DMAX Maximum Duty Cycle % LM2735-Y 91 99 LM2735-X 5 DMIN Minimum Duty Cycle % LM2735-Y 2 SOT-23 and MSOP-PowerPAD 170 330 RDS(ON) Switch On Resistance m Ω WSON 190 350 ICL Switch Current Limit 2.1 3 A SS Soft Start 4 ms LM2735-X 7.0 11 mA Quiescent Current (switching) IQ LM2735-Y 3.4 7 Quiescent Current (shutdown) All Options VEN = 0V 80 nA Undervoltage Lockout VIN Rising 2.3 2.65 V UVLO VIN Falling 1.7 1.9 Shutdown Threshold Voltage See(1) 0.4 VEN_TH V Enable Threshold Voltage See(1) 1.8 I-SW Switch Leakage VSW = 24V 1.0 µA I-EN Enable Pin Current Sink/Source 100 nA WSON and MSOP-PowerPAD Package 80 Junction to Ambient θJA °C/W 0 LFPM Air Flow(2) SOT-23 Package 118 WSON and MSOP-PowerPAD Package 18 θJC Junction to Case(2) °C/W SOT-23 Package 60 TSD Thermal Shutdown Temperature(3) 160 °C Thermal Shutdown Hysteresis 10 (1) Do not allow this pin to float or be greater than VIN +0.3V. (2) Applies for packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air. (3) Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device Copyright © 2007–2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM2735 |
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