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HLMP-EL25-UX000 Scheda tecnica(PDF) 11 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-EL25-UX000 Scheda tecnica(HTML) 11 Page - AVAGO TECHNOLOGIES LIMITED |
11 / 13 page 11 Ammo Pack Drawing Example of Wave Soldering Temperature Profile for TH LED Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. 0 30 100 250 200 150 100 50 TIME (MINUTES) PREHEAT TURBULENT WAVE LAMINAR WAVE HOT AIR KNIFE Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 20 10 40 50 70 90 80 60 18.00 ± 0.50 (0.7087 ± 0.0197) 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) 9.125 ± 0.625 (0.3593 ± 0.0246) 12.70 ± 0.30 (0.50 ± 0.0118) CATHODE 0.70 ± 0.20 (0.0276 ± 0.0079) 20.50 ± 1.00 (0.807 ± 0.039) A A VIEW A–A ∅ 4.00 ± 0.20 (0.1575 ± 0.008) TYP. ALL DIMENSIONS IN MILLIMETERS (INCHES). NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF. |
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Descrizione simile - HLMP-EL25-UX000 |
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