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74VCXH16373 Scheda tecnica(PDF) 1 Page - Fairchild Semiconductor |
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74VCXH16373 Scheda tecnica(HTML) 1 Page - Fairchild Semiconductor |
1 / 11 page © 2005 Fairchild Semiconductor Corporation DS500229 www.fairchildsemi.com January 2000 Revised June 2005 74VCXH16373 Low Voltage 16-Bit Transparent Latch with Bushold General Description The VCXH16373 contains sixteen non-inverting latches with 3-STATE outputs and is intended for bus oriented applications. The device is byte controlled. The flip-flops appear to be transparent to the data when the Latch Enable (LE) is HIGH. When LE is LOW, the data that meets the setup time is latched. Data appears on the bus when the Output Enable (OE) is LOW. When OE is HIGH, the outputs are in a high impedance state. The VCXH16373 data inputs include active bushold cir- cuitry, eliminating the need for external pull-up resistors to hold unused or floating data inputs at a valid logic level. The 74VCXH16373 is designed for low voltage (1.2V to 3.6V) VCC applications with output compatibility up to 3.6V. The 74VCXH16373 is fabricated with an advanced CMOS technology to achieve high speed operation while maintain- ing low CMOS power dissipation. Features s 1.2V to 3.6V VCC supply operation s 3.6V tolerant control inputs and outputs s Bushold on data inputs eliminates the need for external pull-up/pull-down resistors s tPD (In to On) 3.0 ns max for 3.0V to 3.6V VCC s Static Drive (IOH/IOL) r24 mA @ 3.0V VCC s Uses patented noise/EMI reduction circuitry s Latch-up performance exceeds 300 mA s ESD performance: Human body model ! 2000V Machine model ! 200V s Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) (Preliminary) Ordering Code: Note 1: Ordering Code “G” indicates Tray. Note 2: Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Logic Symbol Order Number Package Number Package Description 74VCXH16373G (Note 1)(Note 2) BGA54A (Preliminary) 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide 74VCXH16373MTD (Note 2) MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide |
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