AD73322LAST datasheet(7/40 Pages) AD

Il numero della parte	AD73322LAST

Spiegazioni elettronici	Low Cost, Low Power CMOS General-Purpose Dual Analog Front End

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Produttore elettronici	AD [Analog Devices]

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REV. 0

AD73322L

–7–

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the AD73322L features proprietary ESD protection circuitry, permanent damage may occur on

devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

*

(TA = 25

°C unless otherwise noted)

AVDD, DVDD to GND . . . . . . . . . . . . . . . –0.3 V to +4.6 V

AGND to DGND . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V

Digital I/O Voltage to DGND . . . –0.3 V to (DVDD + 0.3 V)

Analog I/O Voltage to AGND . . . –0.3 V to (AVDD + 0.3 V)

Operating Temperature Range

Industrial (A Version) . . . . . . . . . . . . . . .

–40

°C to +85°C

Extended (Y Version) . . . . . . . . . . . . . . . . –40

°C to +105°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Maximum Junction Temperature . . . . . . . . . . . . . . . . 150

°C

SOIC,

θJA Thermal Impedance . . . . . . . . . . . . . . . 71.4°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

LQFP,

θ

JA Thermal Impedance . . . . . . . . . . . . . . .

53.2

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

ORDERING GUIDE

Temperature

Package

Model

Range

Descriptions

Option

AD73322LAR

–40

°C to +85°C

Wide Body SOIC

R-28

AD73322LARU

–40

°C to +85°C

Thin Shrink TSSOP

RU-28

AD73322LAST

–40

°C to +85°C

Plastic Thin Quad

ST-44A

Flatpack (LQFP)

AD73322LYR

–40

°C to +105°C Wide Body SOIC

R-28

AD73322LYRU

–40

°C to +105°C Thin Shrink TSSOP RU-28

AD73322LYST

–40

°C to +105°C Plastic Thin Quad

ST-44A

Flatpack (LQFP)

EVAL-AD73322LEB

Evaluation Board

PIN CONFIGURATIONS

28-Lead Wide Body SOIC

(R-28)

TOP VIEW

(Not to Scale)

28

27

26

25

24

23

22

21

20

19

18

17

16

15

1

2

3

4

5

6

7

8

9

10

11

12

13

14

AD73322L

SDO

MCLK

SCLK

RESET

DVDD

DGND

AGND2

VINP1

VFBP1

VINN1

VFBN1

AVDD2

REFCAP

REFOUT

SDOFS

SDIFS

SDI

SE

AGND1

AVDD1

VOUTP2

VFBN2

VINN2

VFBP2

VINP2

VOUTN2

VOUTP1

VOUTN1

44-Lead Plastic Thin Quad Flatpack (LQFP)

(ST-44A)

3

4

5

6

7

1

2

10

11

8

9

40 39 38

41

42

43

44

36 35 34

37

29

30

31

32

33

27

28

25

26

23

24

PIN 1

IDENTIFIER

TOP VIEW

(Not to Scale)

AD73322L

12 13 14 15 16 17 18 19 20 21 22

NC

VOUTN1

VOUTP1

NC

VOUTN2

VOUTP2

NC

REFOUT

REFCAP

AVDD2

AGND2

NC = NO CONNECT

AGND2

DGND

DVDD

AVDD1

AGND1

28-Lead Thin Shrink TSSOP

(RU-28)

TOP VIEW

(Not to Scale)

28

27

26

25

24

23

22

21

20

19

18

17

16

15

1

2

3

4

5

6

7

8

9

10

11

12

13

14

AD73322L

SDO

MCLK

SCLK

RESET

DVDD

DGND

AGND2

VINP1

VFBP1

VINN1

VFBN1

AVDD2

REFCAP

REFOUT

SDOFS

SDIFS

SDI

SE

AGND1

AVDD1

VOUTP2

VFBN2

VINN2

VFBP2

VINP2

VOUTN2

VOUTP1

VOUTN1

TSSOP,

θ

JA Thermal Impedance . . . . . . . . . . . . . .

97.9

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

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