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AD5241 Scheda tecnica(PDF) 5 Page - Analog Devices |
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AD5241 Scheda tecnica(HTML) 5 Page - Analog Devices |
5 / 20 page REV. 0 AD5232 –5– ORDERING GUIDE Number of Number of End-to-End Temperature Package Package Devices per Branding * Model Channels R AB (k ) Range ( °C) Description Option Container Information AD5232BRU10 2 10 –40 to +85 TSSOP-16 RU-16 96 5232B10 AD5232BRU10-REEL7 2 10 –40 to +85 TSSOP-16 RU-16 1,000 5232B10 AD5232BRU50 2 50 –40 to +85 TSSOP-16 RU-16 96 5232B50 AD5232BRU50-REEL7 2 50 –40 to +85 TSSOP-16 RU-16 1,000 5232B50 AD5232BRU100 2 100 –40 to +85 TSSOP-16 RU-16 96 5232BC AD5232BRU100-REEL7 2 100 –40 to +85 TSSOP-16 RU-16 1,000 5232BC *Line 1 contains ADI logo symbol and the data code YYWW, line 2 contains detail model number listed in this column. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD5232 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE ABSOLUTE MAXIMUM RATINGS 1 (TA = 25°C, unless otherwise noted) VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7 V VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –7 V VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V VA, VB, VW to GND . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V AX – BX, AX – WX, BX – WX Intermittent 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2 mA Digital Inputs and Output Voltage to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD +0.3 V Operating Temperature Range 3 . . . . . . . . . . . –40 °C to +85°C Maximum Junction Temperature (TJ Max) . . . . . . . . 150 °C Storage Temperature . . . . . . . . . . . . . . . . . . –65 °C to +150°C Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 °C Package Power Dissipation . . . . . . . . . . . . . (TJ Max – TA)/ JA Thermal Resistance Junction-to-Ambient JA, TSSOP-16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 °C/W Thermal Resistance Junction-to-Case JC, TSSOP-16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 °C/W NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Maximum terminal current is bounded by the maximum current handling of the switches, maximum power dissipation of the package, and maximum applied voltage across any two of the A, B, and W terminals at a given resistance. 3Includes programming of nonvolatile memory. |
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