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CDCLVP2108RGZT Scheda tecnica(PDF) 2 Page - Texas Instruments

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Il numero della parte CDCLVP2108RGZT
Spiegazioni elettronici  16 LVPECL Output, High-Performance Clock Buffer
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Produttore elettronici  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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CDCLVP2108
SCAS878B
– MAY 2009 – REVISED AUGUST 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Table 1. AVAILABLE OPTIONS(1)
TA
PACKAGED DEVICES
FEATURES
CDCLVP2108RGZT
48-pin QFN (RGZ) package, small tape and reel
–40°C to +85°C
CDCLVP2108RGZR
48-pin QFN (RGZ) package, tape and reel
(1)
For the most current specifications and package information, see the Package Option Addendum located at the end of this data sheet or
refer to our web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted).
(1)
CDCLVP2108
UNIT
VCC
Supply voltage range(2)
–0.5 to 4.6
V
VIN
Input voltage range (3)
–0.5 to VCC + 0.5
V
VOUT
Output voltage range (3)
–0.5 to VCC + 0.5
V
IIN
Input current
20
mA
IOUT
Output current
50
mA
TA
Specified free-air temperature range (no airflow)
–40 to +85
°C
TSTG
Storage temperature range
–65 to +150
°C
TJ
Maximum junction temperature
+125
°C
ESD
Electrostatic discharge (HBM)
2
kV
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All supply voltages must be supplied simultaneously.
(3)
The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range (unless otherwise noted).
CDCLVP2108
PARAMETER
MIN
TYP
MAX
UNIT
VCC
Supply voltage
2.375
2.50/3.30
3.60
V
TA
Ambient temperature
–40
+85
°C
PACKAGE DISSIPATION RATINGS
(1) (2)
VALUE
TEST
4
× 4 VIAS
PARAMETER
CONDITIONS
ON PAD
UNIT
0 LFM
33.8
°C/W
θJA
Thermal resistance, junction-to-ambient
150 LFM
22.6
°C/W
400 LFM
19.2
°C/W
θJP
(3)
Thermal resistance, junction-to-pad
3.67
°C/W
(1)
The package thermal resistance is calculated in accordance with JESD 51 and JEDEC 2S2P (high-K board).
(2)
Connected to GND with 16 thermal vias (0.3-mm diameter).
(3)
θJP (junction-to-pad) is used for the QFN package, because the primary heat flow is from the junction to the GND pad of the QFN
package.
2
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Copyright
© 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): CDCLVP2108


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