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AMC1100DUBR Scheda tecnica(PDF) 3 Page - Texas Instruments

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Il numero della parte AMC1100DUBR
Spiegazioni elettronici  Fully-Differential Isolation Amplifier for Energy Metering
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
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AMC1100DUBR Scheda tecnica(HTML) 3 Page - Texas Instruments

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AMC1100
www.ti.com
SBAS562 – APRIL 2012
REGULATORY INFORMATION
VDE AND IEC
UL
Certified according to IEC 60747-5-2
Recognized under 1577 component recognition program
File number: 40016131
File number: E181974
IEC 60747-5-2 INSULATION CHARACTERISTICS
Over operating free-air temperature range, unless otherwise noted.
PARAMETER
TEST CONDITIONS
VALUE
UNIT
VIORM
Maximum working insulation voltage
1200
VPEAK
Qualification test: after input/output safety test subgroup
1140
VPEAK
2/3 VPR = VIORM × 1.2, t = 10 s, partial discharge < 5 pC
Qualification test: method A, after environmental tests
VPR
Input-to-output test voltage
subgroup 1, VPR = VIORM × 1.6, t = 10 s, partial discharge
1920
VPEAK
< 5 pC
100% production test: method B1, VPR = VIORM × 1.875,
2250
VPEAK
t = 1 s, partial discharge < 5 pC
VIOTM
Transient overvoltage
Qualification test: t = 60 s
4250
VPEAK
Qualification test: VTEST = VISO, t = 60 s
4250
VPEAK
VISO
Insulation voltage per UL
100% production test: VTEST = 1.2 x VISO, t = 1 s
5100
VPEAK
RS
Insulation resistance
VIO = 500 V at TS
> 109
Ω
PD
Pollution degree
2
°
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output (I/O) circuitry. I/O
circuitry failure can allow low resistance to either ground or supply and, without current limiting, dissipate sufficient power to
overheat the die and damage the isolation barrier, thus potentially leading to secondary system failures.
The safety-limiting constraint is the operating virtual junction temperature range specified in the Absolute Maximum Ratings
table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware
determine the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of
a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface-Mount Packages and
is conservative. The power is the recommended maximum input voltage times the current. The junction temperature is then
the ambient temperature plus the power times the junction-to-air thermal resistance.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
IS
Safety input, output, or supply current
θJA = 246°C/W, VIN = 5.5 V, TJ = +150°C, TA = +25°C
10
mA
TC
Maximum-case temperature
+150
°C
IEC 61000-4-5 RATINGS
PARAMETER
TEST CONDITIONS
VALUE
UNIT
VIOSM
Surge immunity
1.2-
μs or 50-μs voltage surge and 8-μs or 20-μs current surge
±6000
V
IEC 60664-1 RATINGS
PARAMETER
TEST CONDITIONS
SPECIFICATION
Basic isolation group
Material group
II
Rated mains voltage
≤ 150 VRMS
I-IV
Rated mains voltage
≤ 300 VRMS
I-IV
Installation classification
Rated mains voltage
≤ 400 VRMS
I-III
Rated mains voltage < 600 VRMS
I-III
Copyright © 2012, Texas Instruments Incorporated
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