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AMC1100DUBR Scheda tecnica(PDF) 3 Page - Texas Instruments |
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AMC1100DUBR Scheda tecnica(HTML) 3 Page - Texas Instruments |
3 / 22 page AMC1100 www.ti.com SBAS562 – APRIL 2012 REGULATORY INFORMATION VDE AND IEC UL Certified according to IEC 60747-5-2 Recognized under 1577 component recognition program File number: 40016131 File number: E181974 IEC 60747-5-2 INSULATION CHARACTERISTICS Over operating free-air temperature range, unless otherwise noted. PARAMETER TEST CONDITIONS VALUE UNIT VIORM Maximum working insulation voltage 1200 VPEAK Qualification test: after input/output safety test subgroup 1140 VPEAK 2/3 VPR = VIORM × 1.2, t = 10 s, partial discharge < 5 pC Qualification test: method A, after environmental tests VPR Input-to-output test voltage subgroup 1, VPR = VIORM × 1.6, t = 10 s, partial discharge 1920 VPEAK < 5 pC 100% production test: method B1, VPR = VIORM × 1.875, 2250 VPEAK t = 1 s, partial discharge < 5 pC VIOTM Transient overvoltage Qualification test: t = 60 s 4250 VPEAK Qualification test: VTEST = VISO, t = 60 s 4250 VPEAK VISO Insulation voltage per UL 100% production test: VTEST = 1.2 x VISO, t = 1 s 5100 VPEAK RS Insulation resistance VIO = 500 V at TS > 109 Ω PD Pollution degree 2 ° IEC SAFETY LIMITING VALUES Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output (I/O) circuitry. I/O circuitry failure can allow low resistance to either ground or supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, thus potentially leading to secondary system failures. The safety-limiting constraint is the operating virtual junction temperature range specified in the Absolute Maximum Ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determine the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface-Mount Packages and is conservative. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IS Safety input, output, or supply current θJA = 246°C/W, VIN = 5.5 V, TJ = +150°C, TA = +25°C 10 mA TC Maximum-case temperature +150 °C IEC 61000-4-5 RATINGS PARAMETER TEST CONDITIONS VALUE UNIT VIOSM Surge immunity 1.2- μs or 50-μs voltage surge and 8-μs or 20-μs current surge ±6000 V IEC 60664-1 RATINGS PARAMETER TEST CONDITIONS SPECIFICATION Basic isolation group Material group II Rated mains voltage ≤ 150 VRMS I-IV Rated mains voltage ≤ 300 VRMS I-IV Installation classification Rated mains voltage ≤ 400 VRMS I-III Rated mains voltage < 600 VRMS I-III Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): AMC1100 |
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