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SI7794DP-T1-GE3 Scheda tecnica(PDF) 9 Page - Vishay Siliconix

Il numero della parte SI7794DP-T1-GE3
Spiegazioni elettronici  N-Channel 30 V (D-S) MOSFET with Schottky Diode
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Produttore elettronici  VISHAY [Vishay Siliconix]
Homepage  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

SI7794DP-T1-GE3 Scheda tecnica(HTML) 9 Page - Vishay Siliconix

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Document Number 71622
28-Feb-06
Vishay Siliconix
AN821
PowerPAK SO-8 DUAL
The pin arrangement (drain, source, gate pins) and the
pin dimensions of the PowerPAK SO-8 dual are the
same as standard SO-8 dual devices. Therefore, the
PowerPAK device connection pads match directly to
those of the SO-8. As in the single-channel package,
the only exception is the extended drain connection
area. Manufacturers can likewise take immediate
advantage of the PowerPAK SO-8 dual devices by
mounting them to existing SO-8 dual land patterns.
To take the advantage of the dual PowerPAK SO-8’s
thermal performance, the minimum recommended
land pattern can be found in Application Note 826,
Recommended Minimum Pad Patterns With Outline
Drawing Access for Vishay Siliconix MOSFETs. Click
on the PowerPAK 1212-8 dual in the index of this doc-
ument.
The gap between the two drain pads is 24 mils. This
matches the spacing of the two drain pads on the Pow-
erPAK SO-8 dual package.
REFLOW SOLDERING
Vishay Siliconix surface-mount packages meet solder
reflow reliability requirements. Devices are subjected
to solder reflow as a test preconditioning and are then
reliability-tested using temperature cycle, bias humid-
ity, HAST, or pressure pot. The solder reflow tempera-
ture profile used, and the temperatures and time
duration, are shown in Figures 3 and 4.
For the lead (Pb)-free solder profile, see http://
www.vishay.com/doc?73257.
Ramp-Up Rate
+ 6
°C /Second Maximum
Temperature at 155 ± 15
°C
120 Seconds Maximum
Temperature Above 180
°C
70 - 180 Seconds
Maximum Temperature
240 + 5/- 0
°C
Time at Maximum Temperature
20 - 40 Seconds
Ramp-Down Rate
+ 6
°C/Second Maximum
Figure 3. Solder Reflow Temperature Profile
Figure 3. Solder Reflow Temperatures and Time Durations
210 - 220 °C
3 °C(max)
4 °C/s (max)
10 s (max)
183 °C
50 s (max)
Reflow Zone
60 s (min)
Pre-Heating Zone
3 °C(max)
140 - 170 °C
Maximum peak temperature at 240 °C is allowed.


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