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LB1976 Scheda tecnica(PDF) 10 Page - Sanyo Semicon Device |
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LB1976 Scheda tecnica(HTML) 10 Page - Sanyo Semicon Device |
10 / 10 page LB1976 PS No.6088-10/10 SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein. SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. Upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the SANYO Semiconductor Co.,Ltd. product that you intend to use. In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of SANYO Semiconductor Co.,Ltd. 13. Sample calculation for internal power dissipation (approximate) The calculation assumes the following parameters: VCC = 5V VM = 30V Source-side output transistor ON duty cycle 80% (PWM control) Output current IO = 1A (RF pin average current) (1) ICC power dissipation P1 P1 = VCC × ICC = 5V × 14mA = 0.07W (2) Output drive current power dissipation P2 P2 = VM × 11mA = 30V × 11mA = 0.33W (3) Source-side output transistor power dissipation P3 P3 = VO(source) × IO × Duty(on) = 0.9V × 1A × 0.8 = 0.72W (4) Sink-side output transistor power dissipation P4 P4 = VO(sink) × IO = 1.1V × 1A = 1.10W (5) Total internal power dissipation P P = P1 + P2 + P3 + P4 = 2.22W 14. IC temperature Rise Measurement Because the chip temperature of the IC cannot be measured directly, measurement according to one of the following procedures should always be carried out. 14-1. Thermocouple measurement A thermocouple element is mounted to the IC heat dissipation fin. This measurement method is easy to implement, but it will be subject to measurement errors if the temperature is not stable. 14-2. Measurement using internal diode characteristics of IC This is the recommended measurement method. It makes use of the parasitic diode incorporated in the IC between FG1 and GND. Set FG1 to High and measure the voltage VF of the parasitic diode to calculate the temperature. (Sanyo data: for IF = −1mA, VF temperature characteristics are about −2mV/°C) 15. NC Pins Because NC pins are electrically open, they may be used for wiring purpose etc. This catalog provides information as of December, 2008. Specifications and information herein are subject to change without notice. |
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