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BD1606MVV Scheda tecnica(PDF) 9 Page - Rohm |
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BD1606MVV Scheda tecnica(HTML) 9 Page - Rohm |
9 / 12 page Technical Note 9/11 www.rohm.com 2011.04 - Rev.A © 2011 ROHM Co., Ltd. All rights reserved. BD1606MVV ● Recommended PCB layout In PCB design, wire the power supply line in a way that the PCB impedance goes low and provide a bypass capacitor if needed. EN SCL To substrate GND GND SDA To substrate VCC C1 C1 VCC VOUT SDA SCL Rear-side GND EN Fig.16 Application Layout Image (Top View) Fig.17 Front (Top View) ● Application Parts Selection Method Capacitor (Use a ceramics capacitor with good frequency and temperature characteristics.) Symbol Recommended value Recommended parts Type Cout,Cin,C1,C2 1μF GRM188B11A105KA61B(MURATA) Ceramics capacitor Connect an input bypass capacitor CIN between VBAT/VIN and GND pin and an output capacitor between VOUT and GND pin in proximity. Place both C1P-C1N and C2P-C2N capacitors in proximity to the chip Furthermore, select a ceramics capacitor with a sufficient rating for voltage to be applied. When other than these parts are used, the equivalent parts must be used. |
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